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TECHNICAL PAPERS

Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling

[+] Author and Article Information
J. Y. Chang, C. W. Yu, R. L. Webb

Department of Mechanical and Nuclear Engineering, The Pennsylvania State University, University Park, PA 16802-1413

J. Electron. Packag 123(3), 225-231 (Oct 11, 2000) (7 pages) doi:10.1115/1.1348012 History: Received October 11, 2000
Copyright © 2001 by ASME
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References

Wong,  H., and Lee,  T.-Y. T., 1996, “Thermal Evaluation of a PowerPC 620 Microprocessor in a Multiprocessor Computer,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 19, No. 4, pp. 469–477.
Linton, R. L., 1991, “CFD Modeling of Electronic Enclosures,” ASME Heat Transfer in Electronic Equipment, HTD-Vol. 171, pp. 95–100.
Linton,  R. L., and Agonafer,  D., 1994, “Thermal Model of a PC,” ASME J. Electron. Packag., 116, pp. 134–137.
Lee,  T.-Y. T., and Mahalingam,  M., 1994, “Application of a CFD Tool for System-Level Thermal Simulation,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 17, No. 4, pp. 564–571.
Bash, C., and Patel, C., 1999, “Modeling and Metrology for Expedient Analysis and Design of Computer Systems,” Proceedings of 1999 International Systems Packaging Symposium, San Diego, CA, pp. 64–70.
Intel Application Notes, 1998, “Micro-ATX Chassis Design Suggestions,” Version 1.0, Apr.
Intel Datasheets, 1999, “Intel Celeron Processor at 266 MHz, 300 MHz, 333 MHz, 366 MHz, 400 MHz, 433 MHz, 466 MHz and 500 MHz,” Order Number: 243658-009, July.
Patel, C. D., and Ushioda, S., 1999, “Low Cost, High Aspect Ratio Skive Heat Sink for Cooling High Power Devices,” Proceedings of 1999 International Systems Packaging Symposium, pp. 89–94.
Chu, H. W., Belady, C. L., and Patel, C. D., 1999, “A Survey of High-Performance, High Aspect Ratio, Air Cooled Heat Sinks,” Proceedings of 1999 International Systems Packaging Symposium, San Diego, CA, pp. 71–76.
Bergquist Catalog, 1998, Flexible Hi-Flow, Bergquist Co., Minneapolis, MN.
Patel, C. D., and Belady, C. L., 1997, “Modeling and Metrology in High Performance Heat Sink Design,” Proceedings of 1997 Electronic Components and Technology Conference, San Jose, CA, pp. 296–302.
Belady,  C. L., 1996, “Design Considerations for Air Cooling Electronic Systems in High Altitude Condition,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 19, No. 4, pp. 495–500.
ASHRAE Handbook, 1992, HVAC Systems and Equipment, ASHRAE, Inc., Atlanta, GA, pp. 18.4–18.5.
Idelchik, I. E., 1994, Handbook of Hydraulic Resistance, Boca Raton, FL, CRC press.
Incropera, F. P., and DeWitt, D. P., 1996, Fundamentals of Heat and Mass Transfer, 4th Edition, J. Wiley, New York.
Kline, S. J., and McClintock, F. A., 1953, “Describing Uncertainties in Single-Sample Experiments,” Mech. Eng. (Am. Soc. Mech. Eng.), Jan., pp. 3–8.

Figures

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Photographic view of chassis layout (side view)
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Photographic view of vent holes at power supply case
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Layout of major chassis components around CPU (viewed from the bottom of the chassis)
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Layout of system CFD analysis model
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Heat sink geometries and dimensions
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Hydraulic characteristic curves of the power supply fan and vent holes
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Velocity vector profiles seen from the bottom of chassis
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Schematic of air flow test bench
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Thermocouple groove machined on Celeron CPU case (PPGA 370 Package)

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