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TECHNICAL PAPERS

Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging

[+] Author and Article Information
Cemal Basaran

UB Electronic Packaging Laboratory, University at Buffalo, SUNY, Buffalo, NY 14260e-mail: cjb@eng.buffalo.edu

Ying Zhao

Analog Devices, Norwood, MA

J. Electron. Packag 123(3), 218-224 (Jul 06, 1999) (7 pages) doi:10.1115/1.1362674 History: Received July 06, 1999
Copyright © 2001 by ASME
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References

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Figures

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Geometry and material properties
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(a) Elastic FEA with 1380 elements. (b) Elastic FEA with 6440 elements. (c) Elastic FEA with 9900 elements.
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(a) Elastic FEA with 1380 elements. (b) Elastic FEA with 6440 elements. (c) Elastic FEA with 9900 elements.
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Adhesive layer shear stress distribution with viscoplastic model
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Adhesive layer peeling stress distribution with viscoplastic model
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Adhesive layer shear stress distribution with thermo-elasto-viscoplastic model with damage
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Adhesive layer peeling stress distribution with thermo-elasto-viscoplastic model with damage
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Adhesive layer shear stress distribution. Comparison between elastic, thermo-elasto-viscoplastic with damage and Suhir solution.
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Adhesive layer peeling stress distribution. Comparison between elastic, thermo-elasto-viscoplastic with damage and Suhir solution.
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Cross-section of specimen
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U fringe field after one thermal cycle
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V fringe field after one thermal cycle
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Irreversible shear strain distribution

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