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TECHNICAL PAPERS

Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses

[+] Author and Article Information
A. G. Evans

Princeton University, Materials Institute, Princeton, NJ 08540e-mail: anevans@princeton.edu

M. Y. He

Materials Department, University of California, Santa Barbara, CA 93106

J. W. Hutchinson

Division of Engineering and Applied Sciences, Harvard University, Cambridge, MA 02138

M. Shaw

Rockwell International, Thousand Oaks, CA 91360

J. Electron. Packag 123(3), 211-217 (Oct 01, 2000) (7 pages) doi:10.1115/1.1370376 History: Received November 29, 1999; Revised October 01, 2000
Copyright © 2001 by ASME
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References

Figures

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Axial steady-state temperature distributions for heat transfer boundary conditions appropriate to air cooling: (a) z, (b) R3/R1=40
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A schematic showing the four phases subject to analysis
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The magnitude of the gradient coefficient, χ, for a range of system variables
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Transient temperatures, without PCM melting, calculated for typical pulses; (a) effect of heat transfer coefficient, (b) effect of chip thermal conductivity
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The variation in the nondimensional temperature, Δτ (10), with time (absent PCM melting) for three different pulse magnitudes
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(a) Transient temperatures upon PCM melting calculated for three PCM thicknesses. (b) The magnitude of the time coefficient, b, and its dependence on PCM thickness.
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(a) A schematic of the double-sided configuration: PCM1 is a metallic and PCM2 is an organic embedded within a Cu medium. The layers are attached by transient liquid phase bonding (TLP). (b) The thermal conductivities of the constituent materials.
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The finite element mesh used in the calculations
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Axial steady-state temperature distribution for a configuration subject to temperature boundary conditions applicable to water-cooling. Note the appreciable effect of the thermal conductivity of the AlN on the steady-state temperatures.
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Radial temperature distributions in the SiC chip for both temperature and heat transfer boundary conditions

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