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TECHNICAL PAPERS

An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

[+] Author and Article Information
Yong Du, Jie-Hua Zhao, Paul Ho

Laboratory for Interconnect and Packaging, The University of Texas at Austin, PRC/MER, Mail Code R8650, Austin, TX 78712-1100

J. Electron. Packag 123(3), 196-199 (Mar 21, 2000) (4 pages) doi:10.1115/1.1347987 History: Received September 10, 1999; Revised March 21, 2000
Copyright © 2001 by ASME
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References

Chua, Teo Yong, et al., 1995, “BGA Package Analysis using FEA,” SEMICON/West.
Kuan, Lee Choon, and Cheng, Yan Ji, 1998, “Warpage in Plastic IC Packages,” 48th ECTC.
Miyake, Kiyoshi, and Saitou, Kiyoshi, 1997, “Analysis of Warpage of Surface Mount Devices,” JSME The 10th Computer Mechanics Conf.
Finot,  M., Blech,  I. A., Suresh,  S., and Fujimoto,  H., 1997 “Large Deformation and Geometric Instability of Substrate with Thin-film Deposits,” J. Appl. Phys., 81, pp. 3457–3464.
Timoshenko, S., 1940, Theory of Plates and Shells, Chapter II, McGraw-Hill, New York and London.
Zhao, Jie-Hua, Dai, Xiang, and Ho, Paul, 1998, “Analysis and Modeling Verification for Thermal-Mechanical Deformation in Flip-Chip Packages,” 48th ECTC.

Figures

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The measured principal surface curvatures of the package and FEA modeling results
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Schematic drawing of the underfilled flip-chip package
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Experimental configuration to measure 2D curvatures
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Experimental configuration to determine 1D curvature
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The principle to determine the slope of a curve at the incident point. AO is the incident laser beam. ON and ON’ are normal to the sample surface before and during thermal loading. TO is the tangent line of the curve at the laser incident point and OB and OC are reflected beams from the sample before and during thermal loading.
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Experimental setup for 2D surface curvature measurement
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Definition of the lab coordinate and the principal coordinate

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