Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader

[+] Author and Article Information
Koichiro Take

Research and Development Department, Showa Aluminum Corporation, Oyama, Tochigi, Japane-mail: koichiro_take@sdk.co.jp

Ralph L. Webb

Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802e-mail: r5w@psu.edu

J. Electron. Packag 123(3), 189-195 (Apr 01, 2000) (7 pages) doi:10.1115/1.1348010 History: Received April 01, 2000
Copyright © 2001 by ASME
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Xie, H., Aghazadeh, M., Liu, W., and Haley, K., 1995, “Thermal Solution to Pentium Processors in TCP in Notebooks and Sub-Notebooks,” Proc. 45th ECTC Conference, Las Vegas, NV, pp. 201–210.
Xie, H., Aghazadeh, M., and Toth, J., 1995, “The Use of Heat Pipes in the Cooling of Portables with High Power Packages—A Case Study with the Pentium® Processor Based Notebooks and Sub-notebooks,” Proc. 45th ECTC Conference, Las Vegas, NV, pp. 906–913.
Garner, S. D., and Toth, J. E., 1997, “Heat Pipes: A Practical and Cost Effective Method for Maximizing Heat Sink Effectiveness,” Advances in Electronic Packaging, ASME EEP-Vol. 19-2, pp. 1897–1902.
Take, K., Furukawa, Y., and Ushioda, S., 1998, “Fundamental Investigation of Roll Bond Heat Pipes as Heat Spreader Plate for Notebook Computers,” Proc. 6th ITherm Conference, Seattle, WA, pp. 501–506.
Intel Corporation, 1996, “Pentium Processors with Voltage Reduction Technology,” Order No. 242557-005.
Intel Corporation, 1998, “Mobile Pentium II Processor at 233 MHz, 266 MHz, and 300 MHz,” Order No. 243669-002.
Antonetti, V. W., and Yovanovichi, M., 1984, “Thermal Contact Resistance in Microelectronic Equipment,” ISHM Technical Monograph Series, No. 6984-003, pp. 135–151.
Faghri,  A., and Parvani,  S., 1998, “Numerical Analysis of Laminar Flow in a Double-Walled Annular Heat Pipe,” AIAA J. Thermophys. Heat Transfer, 2, No. 3, pp. 165–171.


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Thermal resistance components in heat pipe with aluminum heat spreader plate
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Parallel-channel IP-HP with heat spreader plate
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Cross-sections of capillary channels in IP-HP for (a) evaporator and (b) condenser
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Heat spreader attached to evaporator region of parallel-channel IP-HP
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Effective thermal resistance of 24-loop IP-HP versus heat spreader plate thickness for 10, 16, and 20 W heat input
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Fractional reduction of thermal resistance versus heat spreader plan area for 1.0 mm thick heat spreader
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Aluminum/R-123 integrated plate heat pipe for cooling of notebook computers: (a) top view, (b) side view
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Cross-section of an arc-shaped capillary channel in IP-HP
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Maximum dissipate rate using HTC-60 and Type-44 thermal grease for no heat spreader, 30×30 mm, and 80×50 mm heat spreader
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IP-HP with forced convection in notebook computer




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