Thermal Performance of Integrated Plate Heat Pipe With a Heat Spreader

[+] Author and Article Information
Koichiro Take

Research and Development Department, Showa Aluminum Corporation, Oyama, Tochigi, Japane-mail: koichiro_take@sdk.co.jp

Ralph L. Webb

Department of Mechanical Engineering, The Pennsylvania State University, University Park, PA 16802e-mail: r5w@psu.edu

J. Electron. Packag 123(3), 189-195 (Apr 01, 2000) (7 pages) doi:10.1115/1.1348010 History: Received April 01, 2000
Copyright © 2001 by ASME
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Aluminum/R-123 integrated plate heat pipe for cooling of notebook computers: (a) top view, (b) side view
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Cross-section of an arc-shaped capillary channel in IP-HP
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Thermal resistance components in heat pipe with aluminum heat spreader plate
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Parallel-channel IP-HP with heat spreader plate
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Cross-sections of capillary channels in IP-HP for (a) evaporator and (b) condenser
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Heat spreader attached to evaporator region of parallel-channel IP-HP
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Effective thermal resistance of 24-loop IP-HP versus heat spreader plate thickness for 10, 16, and 20 W heat input
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Fractional reduction of thermal resistance versus heat spreader plan area for 1.0 mm thick heat spreader
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Maximum dissipate rate using HTC-60 and Type-44 thermal grease for no heat spreader, 30×30 mm, and 80×50 mm heat spreader
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IP-HP with forced convection in notebook computer




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