Conjugate Heat Transfer From a Two-Layer Substrate Model of a Convectively Cooled Circuit Board

[+] Author and Article Information
S. A. Harman, K. D. Cole

Mechanical Engineering Dept., University of Nebraska, Lincoln, NE 68588

J. Electron. Packag 123(2), 156-158 (Mar 31, 2000) (3 pages) doi:10.1115/1.1348011 History: Received March 31, 2000

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Ortega, A., 1996, “Conjugate Heat Transfer in Forced Air Cooling of Electronic Components,” Air Cooling Technology for Electronic Equipment, S. Kim and S. Lee, eds., CRC Press, New York, pp. 107–114.
Zebib,  A., and Wo,  Y. K., 1989, “A two-dimensional conjugate heat transfer model for forced air cooling of an electronic device,” ASME J. Electron. Packag., 111, pp. 41–45.
Gorobets,  V. G., 1995, “Local and global heat transfer performance of a plate fin with a low thermal conductivity coating,” Heat Transfer Research, 26, Nos. 3–8, pp. 445–461.
Chen,  H., Lan,  Z., and Wang,  T. I., 1994, “Study of conjugate conduction-laminar film condensation for a vertical plate fin,” Int. J. Heat Mass Transf., 37, No. 16, pp. 2592–2597.
Palisoc,  A., and Lee,  C. C., 1988, “Thermal properties of the multilayer infinite plate structure,” J. Appl. Phys., 64, No. 64, pp. 410–415.
Lee,  C. C., Palisoc,  A., and Min,  Y., 1989, “Thermal Analysis of Integrated Circuit Devices and Packages,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 12, No. 4, pp. 701–709.
Lee,  C. C., Min,  Y., and Palisoc,  A., 1989, “A General Integration Algorithm for the Inverse Fourier Transform of Four-Layer Infinite Plate Structures,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 12, No. 4, pp. 710–716.
Lee, C. C., and Min, Y., 1991, “Thermal Modeling of Semiconductor Devices and Packages using Analytical Methods,” National Electronic Packaging and Production Conference, Anaheim, CA, Vol. 1, pp. 147–160.
Cole,  K. D., 1997, “Conjugate heat transfer from a small heated strip,” Int. J. Heat Mass Transf., 40, No. 11, pp. 2709–2719.
Harman, S. A., 1998, “Conjugate heat transfer: the effects of axial conduction and the two component wall,” M. S. thesis, University of Nebraska, Lincoln, NE.


Grahic Jump Location
Conjugate heat transfer geometry
Grahic Jump Location
Dimensionless heat flux to the fluid at Λ=1,D2+=100, and various D1+K
Grahic Jump Location
Modified spatial average temperature versus Λ/Deff+ for D2+=100, and various D1+K
Grahic Jump Location
Modified spatial average temperature versus Λ for various D2+, and D1+K




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