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TECHNICAL BRIEF

Conjugate Heat Transfer From a Two-Layer Substrate Model of a Convectively Cooled Circuit Board

[+] Author and Article Information
S. A. Harman, K. D. Cole

Mechanical Engineering Dept., University of Nebraska, Lincoln, NE 68588

J. Electron. Packag 123(2), 156-158 (Mar 31, 2000) (3 pages) doi:10.1115/1.1348011 History: Received March 31, 2000

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Copyright © 2001 by ASME
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References

Figures

Grahic Jump Location
Conjugate heat transfer geometry
Grahic Jump Location
Dimensionless heat flux to the fluid at Λ=1,D2+=100, and various D1+K
Grahic Jump Location
Modified spatial average temperature versus Λ/Deff+ for D2+=100, and various D1+K
Grahic Jump Location
Modified spatial average temperature versus Λ for various D2+, and D1+K

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