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PAPERS ON RELIABILITY

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation

[+] Author and Article Information
Krishna Darbha, Abhijit Dasgupta

CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20742

J. Electron. Packag 123(2), 141-146 (Oct 10, 2000) (6 pages) doi:10.1115/1.1328744 History: Received October 10, 2000
Copyright © 2001 by ASME
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References

Houmat,  A., 1997, “An alternative hierarchical finite element formulation applied to plate vibrations,” J. Sound Vib., 206, No. 2, pp. 201–215.
Syed, A., 1997, “ACES of finite element and life prediction models for solder joint reliability,” Design and Reliability of Solders and Solder Interconnections, R. K. Mahidhara, D. R. Frear, S. M. L. Sastry, K. L. Murty, P. K. Liaw, and W. Winterbottom, eds., The Minerals, Metals and Materials Society, pp. 347–354.
Zienkiewicz,  O. C., De,  J. P., Gago,  S. R., and Kelly,  D. W., 1983, “The hierarchical concept in finite element analysis,” Comput. Struct., 16, Nos. 1–4, pp. 53–65.
Ling, S., and Dasgupta, A., 1996, “A nonlinear multi-domain stress analysis method for surface-mount solder joints,” ASME J. Electron. Packag., 118 , June.
Ling, S., and Dasgupta, A., 1996, “A nonlinear multi-domain thermomechanical stress analysis method for surface-mount solder joints: Part II: viscoplastic analysis,” Proceedings of 8th Annual Mechanics of Surface Mount Assemblies Symposium at the ASME International Mechanical Engineering Congress and Exposition, Atlanta, GA.
Ling, S., 1997, “A multi-domain Rayleigh-Ritz method for thermomechanical stress analysis of surface mount interconnects in electronic assemblies,” Ph.D. dissertation, University of Maryland.
Rassaian, M., and Lee, J., 1998, “Thermomechanical multi-domain stress modeling for fatigue analysis of electronic packaging,” 1998 IEEE Aerospace Conference, Los Alamitos, CA, Vol. 1, pp. 399–408.
Darbha, K., Okura, J., Dasgupta, A., and Caers, J. F. J. M., 1997, “A Multi-Domain Thermomechanical Stress Analysis Method for Flip Chip Solder Interconnects,” ASME Winter Annual Conference, 1997, Loews, Anatole.
George, A., and Liu, J., 1981, Computer Solution of Large Sparse Positive Definite Systems, Prentice-Hall, New Jersey.
Cook, R. D., 1981, Concepts and applications of Finite Element Analysis, 2nd Ed., Wiley, NY.

Figures

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Schematic comparison of conventional finite element mesh with NFEM mesh
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Schematic comparison of nesting localized subelements
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Terminology of possible configurations of colonies of nested subelements within a main element
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Illustration of mapping of element from physical to computational domain
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NFEM mesh with one nested subelement for each main element
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NFEM mesh with two nested subelements for each main element
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A schematic illustration of a simple bar with dissimilar materials and illustration of a thermal loading profile
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Stress-strain hysteresis in element 2 obtained from NFEM viscoplastic analysis

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