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PAPERS ON RELIABILITY

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part I: Theory and Formulation

[+] Author and Article Information
Krishna Darbha, Abhijit Dasgupta

CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20742

J. Electron. Packag 123(2), 141-146 (Oct 10, 2000) (6 pages) doi:10.1115/1.1328744 History: Received October 10, 2000
Copyright © 2001 by ASME
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References

Figures

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Schematic comparison of conventional finite element mesh with NFEM mesh
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Schematic comparison of nesting localized subelements
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Terminology of possible configurations of colonies of nested subelements within a main element
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Illustration of mapping of element from physical to computational domain
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NFEM mesh with one nested subelement for each main element
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NFEM mesh with two nested subelements for each main element
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A schematic illustration of a simple bar with dissimilar materials and illustration of a thermal loading profile
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Stress-strain hysteresis in element 2 obtained from NFEM viscoplastic analysis

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