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TECHNICAL PAPERS

Applications of a Decomposed Analysis Procedure for Area-Array Packages

[+] Author and Article Information
Terrace B. Thompson, Ganesh Subbarayan

Department of Mechanical Engineering, University of Colorado at Boulder, Boulder, CO 80309

J. Electron. Packag 123(2), 132-140 (Sep 14, 2000) (9 pages) doi:10.1115/1.1339197 History: Received August 30, 1999; Revised September 14, 2000
Copyright © 2001 by ASME
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References

SIA, Semiconductor Industry Association, 1997, “The National Technology Roadmap for Semiconductors.”
Deshpande,  A., and Subbarayan,  G., 2000, “Decomposition techniques for the efficient analysis of area array packages.” ASME J. Electron. Packag., 122, No. 1, pp. 13–19.
Farhat,  C., and Wilson,  E., 1987, “A New Finite Element Concurrent Computer Program Architecture,” Int. J. Numer. Methods Eng., 24, pp. 1771–1792.
Farhat,  C., and Crivelli,  L., 1989, “A general approach to nonlinear FE computations on shared-memory multiprocessors,” Comput. Methods Appl. Mech. Eng., 72, No. 2, pp. 153–171.
Haftka, R. T., and Gurdal, Z., 1992, “Elements of Structural Optimization,” Kluwer Academic Publications, Dordrecht, The Netherlands.
Zienkiewicz, O. C., and Taylor, R. L., 1989 The Finite Element Method. Volume 1, McGraw-Hill, London.
Deshpande,  A., Subbarayan,  G., and Rose,  D., 2000, “A System for First Order Reliability Estimation Of Solder Joints In Area Array Packages,” ASME J. Electron. Packag., 122, No. 1, pp. 6–12.
Zhang, L., Hunter, B., Subbarayan, G., and Rose, D., 1999, “The Accuracy of Structural Approximations Employed in Analysis of Area Array Packages,” IEEE Components, Packaging and Manufacturing Technology, Part A, Vol. 22, No. 4, pp. 525–533.
Montgomery, Douglas C., 1997, Introduction to Statistical Quality Control, 3rd Ed., Wiley, New York.
Subbarayan,  G., 1996, “A Procedure for Automated Shape and Life Prediction in Flip-Chip and BGA Solder Joints,” ASME J. Electron. Packag., 118, pp. 127–133.
Schittkowski,  K., 1985/1986, “NLPQL: A Fortran subroutine solving constrained nonlinear programming problems,” Ann. Oper. Res., 5, pp. 485–500.
ABAQUS User’s Manual, 1997, Version 5.7, Hibbit, Karlsson & Sorensen Inc., Pawtucket, RI.
Digital Computations, Inc., 1997, User’s Guide, DOE—KISS, Colorado Springs, CO, Air Academy Press and Associates, LLC.

Figures

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A heuristic decomposition of area-array packages
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Parametric representation of displacement fields at solder/PCB and solder/component interfaces
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Relative displacements between the bottom and top interfaces of a solder joint
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A typical finite element model of the solder joint
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Typical code input deck for decomposed analysis
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Flow control in the program
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Finite element models of hypothetical 2-D electronic packages
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The 3-D finite element model of the 5×5 package used for verification of decomposed analysis results
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The cross-section of the hypothetical 5×5 package
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The 3-D finite element model of the 225 I/O PBGA electronic package
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Cross-section of the 225 I/O PBGA electronic package
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A comparison of displacements at solder joints J1-J6 between decomposed solution and full 3-D finite element analysis
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A comparison of displacements at diagonal solder joints 1-8 (J1-J8) between decomposed solution and full 3-D finite element analysis
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Relative shear displacement comparisons (Zhang et al. 8)
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225 I/O PBGA shear gradient/relative error plot

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