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TECHNICAL PAPERS

Forced Convection Board Level Thermal Design Methodology for Electronic Systems

[+] Author and Article Information
Reena Cole, Tara Dalton, Jeff Punch, Mark R. Davies, Ronan Grimes

PEI Technologies: Stokes Research Institute, Department of Mechanical and Aeronautical Engineering, University of Limerick, Limerick, Ireland

J. Electron. Packag 123(2), 120-126 (Jul 21, 2000) (7 pages) doi:10.1115/1.1339822 History: Received September 11, 1999; Revised July 21, 2000
Copyright © 2001 by ASME
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References

Figures

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Double Euro-Card multi-component thermal test vehicle (all dimensions in mm)
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Additional column of components (airflow is from left to right)
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Test vehicle in the working section of the wind tunnel
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Thermal resistance as a function of Reynolds number measured under SEMI conditions
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Aerodynamic and Thermal factors for middle component in center row 8
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Aerodynamic factors with the geometry of the leading edge column varied
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Aerodynamic factors for extra column with same geometry, with varying spacing
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Aerodynamic factors for extra column double height, with varying spacing
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Aerodynamic factors for extra column half-height, with varying spacing
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Aerodynamic factors of extra column half-streamwise length, with varying spacing
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Design graph: aerodynamic influence factor for all components with a low profile upstream blockage

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