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TECHNICAL PAPERS

Forced Convection Board Level Thermal Design Methodology for Electronic Systems

[+] Author and Article Information
Reena Cole, Tara Dalton, Jeff Punch, Mark R. Davies, Ronan Grimes

PEI Technologies: Stokes Research Institute, Department of Mechanical and Aeronautical Engineering, University of Limerick, Limerick, Ireland

J. Electron. Packag 123(2), 120-126 (Jul 21, 2000) (7 pages) doi:10.1115/1.1339822 History: Received September 11, 1999; Revised July 21, 2000
Copyright © 2001 by ASME
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References

Burgos, J., Manno, V. P., and Azar, K.,1995, “Achieving Accurate Thermal Characterization Using a CFD Code—A Case Study of Plastic Packages,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, pp. 732–738.
Dutta, V. B., 1998, “Junction-to-case Thermal Resistance—Still a Myth?,” Proceedings of the 4th Annual IEEE SEMI-THERM Symposium, pp.8–11.
Siegal, B. S., 1988, “Factors Affecting Semiconductor device Thermal Resistance Measurements,” Proceedings of the 4th Annual IEEE SEMI-THERM Symposium, pp.12–18.
Malhammer, A., 1993, “An Experimental Method for Determining Two Thermal Parameters in Microcircuit Packages,” Presented at EUROTHERM Seminar No. 29—Thermal Management of Electronic Systems, Delft, Holland.
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Azar, K., 1993, “A New Method for the Measurement of External and Internal Thermal Resistances,” Presented at EUROTHERM Seminar No. 29—Thermal Management of Electronic Systems, Delft, Holland.
Rosten, H. I., 1995, “Delphi—A Status Report on the ESPRIT Funded Project for the Creation and Validation of Thermal Models of Electronic Parts,” EUROTHERM Seminar No. 45—Thermal Management of Electronic Systems, Leuven, Belgium.
Davies,  M. R. D., Cole,  R., and Lohan,  J., 2000, “Factors Affecting the Operational Thermal Resistance of Electronic Components,” ASME J. Electron. Packag., 122, pp. 185–191.
Lin, P. C., and Nguyen, L. T., 1993, “Thermal Characteristics of IC Packages,” Presented at EUROTHERM Seminar No. 29—Thermal Management of Electronic Systems, Delft, Holland.
Rodgers, P., Lohan, J., Eveloy, V., Fager, C.-M., and Rantala, J., 1999, “Validating Numerical Predictions of Component Thermal Interaction on Electronic Printed Circuit Boards in Forced Convection Airflows by Experimental Analysis,” ASME EEP-Vol. 26-1, Advances in Electronic Packaging, Vol. 1, pp. 999–1009.
Rodgers, P., Eveloy, V., Lohan, J., Fager, C.-M., and Rantala, J., 1999, “Experimental Validation of Numerical Heat Transfer Predictions for Single- and Multi-Component Printed Circuit Boards in a Forced Convection Environment; Part 2—Results and Discussion,” Proceedings of the 33rd ASME National Heat Transfer Conference, Paper No. NHTC 99-0325.
Eveloy,  V., Lohan,  J., and Rodgers,  P., 2000, “A Benchmark Study of Computational Fluid Dynamics Predictive Accuracy for Component—Printed Circuit Board Heat Transfers,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 23, No. 3, pp. 568–577.
Lasance, C., 1997, “Status and Challenges in Thermal Design of Electronic Parts and System,” Proceedings of Eurotherm Seminar No. 58: Thermal Management of Electronic Systems III, Nantes, France, pp. 91–107.
Lohan, J., Tiilikka, P., Rodgers, P., Fater, C.-M., and Rantala, J., 2000, “Using Experimental Analysis to Evaluate the Influence of Printed Circuit Board Construction on the Thermal Performance of Four Package Types in both Natural and Forced Convection,” Proceedings of the 7th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, May.
JEDEC International Standards, 1999, JESD51-7 “High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages,” Electronic Industries Alliance, Eng. Dept.
SEMI Int. Standards, 1996, “G38-0996 Test Method for Still- and Forced-Air Junction-to-Ambient Thermal Resistance Measurements of Integrated Circuit Packages,” Packaging Volume.
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Figures

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Design graph: aerodynamic influence factor for all components with a low profile upstream blockage
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Aerodynamic factors of extra column half-streamwise length, with varying spacing
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Aerodynamic factors for extra column half-height, with varying spacing
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Aerodynamic factors for extra column double height, with varying spacing
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Aerodynamic factors for extra column with same geometry, with varying spacing
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Aerodynamic factors with the geometry of the leading edge column varied
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Aerodynamic and Thermal factors for middle component in center row 8
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Thermal resistance as a function of Reynolds number measured under SEMI conditions
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Test vehicle in the working section of the wind tunnel
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Additional column of components (airflow is from left to right)
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Double Euro-Card multi-component thermal test vehicle (all dimensions in mm)

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