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PAPERS ON RELIABILITY

Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials

[+] Author and Article Information
Takashi Aihara, Shingo Ito, Hideaki Sasajima, Ken Oota

Electronic Device Materials Research Laboratory, Sumitomo Bakelite Co., LTD., 20-7 Kiyohara Industrial Park Utsunomiya-City, Tochigi 321-3231, Japan

J. Electron. Packag 123(1), 88-94 (Aug 08, 2000) (7 pages) doi:10.1115/1.1329129 History: Received August 08, 2000
Copyright © 2001 by ASME
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References

Figures

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Solder crack failure versus water absorption ratio
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Solder crack resistance for several compounds
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Solder crack failure versus Water absorption ratio of molding compound
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Solder crack failure versus elastic modulus at 240°C
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Shear stress contour figure for FPBGA
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Result of analysis about the effect of compound’s property
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The result of anti solder crack resistance test (Test condition: 30°C 85 percent × 2)
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Typical fracture interface of failed package with application of conductive paste
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Typical fracture interface of failed package with application of insulation paste
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Observation for conductive paste
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Observation for insulation paste
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Step observation for conductive paste
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Step observation for insulation paste
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MAP-BGA package used for this study
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FPBGA package failure after soldering
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FPBGA package used for this study
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Solder crack resistance for conductive paste

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