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PAPERS ON RELIABILITY

Thermal and Mechanical Loading Effects on the Reliability of Organic Flip Chip Package

[+] Author and Article Information
Teck Joo Goh

Intel Products (M) Sdn. Bhd., Assembly Technology Development-Malaysia, Lot 8, Jalan Hi-Tech 2/3, Kulim Hi-Tech Park, Kulim, 09100, Kedah, Malaysiae-mail: Teck.Joo.Goh@intel.com

J. Electron. Packag 123(1), 83-87 (Apr 10, 2000) (5 pages) doi:10.1115/1.1289999 History: Revised April 10, 2000
Copyright © 2001 by ASME
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References

Figures

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Finite element mechanical model of FTV package
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Temperature profile of T/C “B”
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Force profile for DOE I: heat sink clip engagement simulation
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MTS normal loading setup
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Schematic of FTV specimen loaded with spring loaded compression fixture
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Displaced shape of the post-simulated assembly process finite element model
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Displaced shape of the post-simulated socketing process finite element model
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Displaced shape of the post mechanical loading and T/C “B” finite element model
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Critical stresses of the die, underfill, and substrate in each simulation step
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Moiré fringe patterns of pre and post edge loading specimens: (a) preloading; (b) post-100 lb; (c) post-200 lb 2
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Moiré fringe patterns of pre and post edge loading specimens: (a) preloading; (b) post-40 lb; (c) post-100 lb 2
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Chip capacitor solder joint strength distribution at various stages of DOE III

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