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TECHNICAL PAPERS

Development of Glass-Free Metal Electrically Conductive Thick Films

[+] Author and Article Information
Zongrong Liu, D. D. L. Chung

Composite Materials Research Laboratory, State University of New York at Buffalo, Buffalo, NY 14260-4400

J. Electron. Packag 123(1), 64-69 (Jul 13, 2000) (6 pages) doi:10.1115/1.1329131 History: Received July 13, 2000
Copyright © 2001 by ASME
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References

Figures

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Typical surface SEM micrograph of the air-fired thick film
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Microstructure of silver in the thick film
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The morphology and distribution of Sn on the surface (a) and in the cross section (b) of the thick film (corresponding to composition C)
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The morphology and distribution of Zn on the surface of the thick film (corresponding to composition E)
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The morphology and distribution of TiCu alloy component on the surface (a) and in the cross section (b) of the thick film (corresponding to composition C)
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The cross-section micrograph of the thick film. (a): corresponding to composition C; (b): corresonding to composition E
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SEM micrographs of the scratch path of thick films of (a) composition C, and (b) composition E

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