Development of Glass-Free Metal Electrically Conductive Thick Films

[+] Author and Article Information
Zongrong Liu, D. D. L. Chung

Composite Materials Research Laboratory, State University of New York at Buffalo, Buffalo, NY 14260-4400

J. Electron. Packag 123(1), 64-69 (Jul 13, 2000) (6 pages) doi:10.1115/1.1329131 History: Received July 13, 2000
Copyright © 2001 by ASME
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Grahic Jump Location
Typical surface SEM micrograph of the air-fired thick film
Grahic Jump Location
Microstructure of silver in the thick film
Grahic Jump Location
The morphology and distribution of Sn on the surface (a) and in the cross section (b) of the thick film (corresponding to composition C)
Grahic Jump Location
The morphology and distribution of Zn on the surface of the thick film (corresponding to composition E)
Grahic Jump Location
The morphology and distribution of TiCu alloy component on the surface (a) and in the cross section (b) of the thick film (corresponding to composition C)
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The cross-section micrograph of the thick film. (a): corresponding to composition C; (b): corresonding to composition E
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SEM micrographs of the scratch path of thick films of (a) composition C, and (b) composition E




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