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TECHNICAL PAPERS

A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder Joints

[+] Author and Article Information
J. K. Chen, J. E. Beraun

Directed Energy Directorate, Air Force Research Laboratory, Kirtland AFB, NM 87117

D. Y. Tzou

Department of Mechanical and Aerospace Engineering, University of Missouri at Columbia, Columbia, MO 65211

J. Electron. Packag 123(1), 52-57 (Jun 27, 2000) (6 pages) doi:10.1115/1.1326438 History: Received June 23, 1999; Revised June 27, 2000
Copyright © 2001 by ASME
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References

Figures

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One-dimensional interfacial compound layer growth
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Four types of interfacial layer growth kinetics: Fick’s behavior (Z=1), gradient-precedence (0<Z<1), mass flux-precedence (1<Z), and diffusion wave (Z=0)
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Comparison of Cu3Sn layer thickness predicted by CDC, VDC, and DPLD models with experimental data (Erickson et al. 4)
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Comparison of Cu6Sn5 layer thickness predicted by CDC, VDC, and DPLD models with experimental data (Erickson et al. 4)
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Comparison of Ag5Zn8 layer thickness predicted by Fick’s law and DPLD model with experimental data (Williams et al. 12)
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Comparison of intermetallic layer in the eutectic solder/copper substrate predicted by Fick’s law and DPLD model with experimental data (Wu et al. 3)

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