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TECHNICAL PAPERS

Moisture Diffusion in Epoxy Molding Compounds Filled With Particles

[+] Author and Article Information
M. Uschitsky, E. Suhir

Bell Laboratories, Lucent Technologies, Inc., 600 Mountain Ave., Murray Hill, NJ 07974

J. Electron. Packag 123(1), 47-51 (Sep 02, 1998) (5 pages) doi:10.1115/1.1325009 History: Revised September 02, 1998; Received July 26, 2000
Copyright © 2001 by ASME
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References

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Figures

Grahic Jump Location
Morphology of the fractured surfaces examined by SEM
Grahic Jump Location
(a) Original EMF-710 HL compound (b) compound mixed with 15 percent of alumina nitride

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