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TECHNICAL PAPERS

Microwave Imaging for the Integrity Assessment of IC Packages

[+] Author and Article Information
Y. Ju, M. Saka

Department of Mechanical Engineering, Tohoku University, Aoba 01, Aramaki, Aoba-ku, Sendai 980-8579, Japan

H. Abé

Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577, Japan

J. Electron. Packag 123(1), 42-46 (Jul 18, 2000) (5 pages) doi:10.1115/1.1326440 History: Received July 30, 1999; Revised July 18, 2000
Copyright © 2001 by ASME
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References

Figures

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Actual delamination and crack observed by microscope
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Configuration of the imaging system
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Configuration of the open-ended coaxial line sensor
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Photograph of the aluminum strip sample
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Descriptive geometry of the package sample
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Package images obtained by SAT: (a) sample with delamination; (b) sample without delamination
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Measured phase along x-direction for aluminum strip sample by different sensors (standoff distance 0.5 mm, frequency 20 GHz)
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Measured phase along x-direction for aluminum strip sample with different standoff distances (sensor 1, frequency 20 GHz)
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Measured phase along x-direction for aluminum strip sample at different frequencies (sensor 1, standoff distance 0.5 mm)
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Microwave images of the aluminum strip sample: (a) measured by Sensor 1; (b) measured by Sensor 2
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Microwave images of package samples measured by Sensor 2: (a) sample with delamination; (b) sample without delamination
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Microwave images of package samples measured by Sensor 1: (a) sample with delamination; (b) sample without delamination

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