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TECHNICAL PAPERS

Microwave Imaging for the Integrity Assessment of IC Packages

[+] Author and Article Information
Y. Ju, M. Saka

Department of Mechanical Engineering, Tohoku University, Aoba 01, Aramaki, Aoba-ku, Sendai 980-8579, Japan

H. Abé

Tohoku University, 2-1-1 Katahira, Aoba-ku, Sendai 980-8577, Japan

J. Electron. Packag 123(1), 42-46 (Jul 18, 2000) (5 pages) doi:10.1115/1.1326440 History: Received July 30, 1999; Revised July 18, 2000
Copyright © 2001 by ASME
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References

Kawamura, N., Kawakami, T., Matsumoto, K., Sawada, K., and Taguchi, H., 1993, “Structural Integrity Evaluation for a Plastic Package During the Soldering Process,” Advances in Electronic Packaging, Vol. 1, Structural Analysis, Materials and Processes, Design, Reliability, ASME, EEP-Vol. 4-1, pp. 91–95.
Tay,  A. A. O., Tan,  G. L., and Lim,  T. B., 1994, “Predicting Delamination in Plastic IC Packages and Determining Suitable Mold Compound Properties,” IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 17, pp. 201–208.
Lee,  H., and Earmme,  Y. Y., 1996, “A Fracture Mechanics Analysis of the Effects of Material Properties and Geometries of Components on Various Types of Package Cracks,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 19, pp. 168–178.
Omi,  S., Fujita,  K., Tsuda,  T., and Maeda,  T., 1991, “Causes of Cracks in SMD and Type Specific Remedies,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 14, pp. 818–823.
Diener,  L., 1995, “Microwave Near-Field Imaging with Open-Ended Waveguide—Comparison with Other Techniques of Nondestructive Testing,” Res. Nondestruct. Eval., 7, pp. 137–152.
Gopalsami,  N., Bakhtiari,  S., Dieckman,  S. L., Raptis,  A. C., and Lepper,  M. J., 1994, “Millimeter-Wave Imaging for Nondestructive Evaluation of Materials,” Mater. Eval., 52, pp. 412–415.
Qaddoumi,  N., Carriveau,  G., Ganchev,  S., and Zoughi,  R., 1995, “Microwave Imaging of Thick Composite with Defects,” Mater. Eval., 53, pp. 926–929.
Pozar, D. M., 1990, Microwave Engineering, Addison-Wesley, New York, NY.
Ju, Y., Saka, M., and Abé, H., 1997, “A Method for Nondestructive Testing of Defects in Dielectric Material Utilizing Coaxial Line Sensor Technique,” Proc. International Conference on Materials and Mechanics ’97, JSME, Tokyo, pp. 401–404.
Grant,  J. P., Clarke,  R. N., Symm,  G. T., and Spyrou,  N. M., 1989, “A Critical Study of the Open-Ended Coaxial Line Sensor Technique for RF and Microwave Complex Permittivity Measurements,” J. Phys. E, 22, pp. 757–770.
Mosig,  J. R., Besson,  J. E., Gex-fabry,  M., and Gardiol,  F. E., 1981, “Reflection of an Open-Ended Coaxial Line and Application to Nondestructive Measurement of Materials,” IEEE Trans. Instrum. Meas., IM-30, pp. 46–51.
Ju,  Y., Saka,  M., and Abé,  H., 1999, “Microwave Nondestructive Detection of Delamination in IC Packages Utilizing Open-Ended Coaxial Line Sensor,” NDT & E Int., 32, pp. 259–264.
Ju, Y., Saka, M., and Abé, H., 1998, “Microwave Imaging for Nondestructive Inspection of Delamination in IC Packages by Open-Ended Coaxial Line Sensor,” Proc. of the Workshop on Mechanical Reliability of Polymeric Materials & Plastic Packages of IC Devices, ASME/IEEE-CPMT/IMAPS, Paris, EEP-Vol. 25, pp. 265–270.

Figures

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Actual delamination and crack observed by microscope
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Configuration of the imaging system
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Configuration of the open-ended coaxial line sensor
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Photograph of the aluminum strip sample
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Descriptive geometry of the package sample
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Package images obtained by SAT: (a) sample with delamination; (b) sample without delamination
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Measured phase along x-direction for aluminum strip sample by different sensors (standoff distance 0.5 mm, frequency 20 GHz)
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Measured phase along x-direction for aluminum strip sample with different standoff distances (sensor 1, frequency 20 GHz)
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Measured phase along x-direction for aluminum strip sample at different frequencies (sensor 1, standoff distance 0.5 mm)
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Microwave images of the aluminum strip sample: (a) measured by Sensor 1; (b) measured by Sensor 2
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Microwave images of package samples measured by Sensor 2: (a) sample with delamination; (b) sample without delamination
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Microwave images of package samples measured by Sensor 1: (a) sample with delamination; (b) sample without delamination

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