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TECHNICAL PAPERS

Evaluation of the Moisture Sensitivity of Molding Compounds of IC’s Packages

[+] Author and Article Information
H. Frémont, J. Y. Delétage, A. Pintus, Y. Danto

IXL, Université Bordeaux 1, ENSERB, CNRS UMR 5818, 351 Cours de la Libération, 33405 Talence Cedex France

J. Electron. Packag 123(1), 16-18 (Jan 01, 2000) (3 pages) doi:10.1115/1.1326436 History: Received January 01, 2000
Copyright © 2001 by ASME
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References

McCluskey, P., Munamarty, R., and Pecht, M., 1996, “Popcorning in PBGA packages during IR reflow soldering,” Proc. of the 1996 International Electronic Packaging Conference, pp. 271–281.
Tanaka, N., Kinato, M., Kumazawa, T., and Nishimuri, A., 1997, “Evaluation of interface delamination in IC packages by considering swelling of the molding compound due to moisture absorption,” Proc. of the 1997 Electronic Components and Technology Conference, pp. 78–83.
Shook,  R. L., Conrad,  T. R., Sastry,  V. S., and Steele,  D. B., 1996, “Diffusion model to derate sensitive surface mount IC’s for factory use conditions,” IEEE Trans. Compon. Packag. Manufact. Technol. Part C, 19, No. 2, pp. 110–118.
Shook, R. L., Vacaro, B. T., and Gerlach, D. L., 1998, “Method for equivalent acceleration of JEDEC/IPC moisture sensitivity levels,” Proc. of the IRPS.
Wong, E. H., Teo, Y. C.., and Lim, T. B., 1998, “Moisture diffusion and vapor pressure modeling of IC packaging” Proc. of the 1998 Electronic Components and Technology Conference, pp. 1372–1378.
Holalkere, V., Mirano, S., Kuo, A. Y., and Chen, W. T., 1997, “Evaluation of plastic package delamination via reliability testing and fracture mechanism approach,” Proc. of the 1997 Electronic Components and Technology Conference, pp. 430–435.
Crank, J., 1975, The Mathematics of Diffusion, 2nd Ed., Oxford.
Cai,  L. W., and Weistman,  Y., 1994, “Non-Fickian moisture diffusion in polymeric composites,” J. Compos. Mater., 28, No. 2, pp. 130–154.
Rousseau, C., Lombaërt-Valot, I., and Chopin, J. M., 1992, “Evolution of molding material of biased plastic package components aged by hygrothermic cycling,” IEEE/ISHM ’92 Symposium, pp. 100–107.
Wong,  T. C., and Broutman,  L. J., 1985, “Moisture diffusion in epoxy resins,” Polym. Eng. Sci., Parts 1 and 2, 25 , No. 9, June.

Figures

Grahic Jump Location
SEM view of resin RA at t=0
Grahic Jump Location
Resin RA: relative weight gain as a function of time and RH
Grahic Jump Location
Relative weight gain as a function of time for the 3 types of PQFP’s at 80°C/85 percent RH
Grahic Jump Location
Relative weight gain as a function of time for the PQFP and the pure resin (here RS) at 80°C/85 percent RH
Grahic Jump Location
Maximum relative weight gain as a function of RH
Grahic Jump Location
Comparison between the Fick’s law and the measurement if only the “first saturation” is taken into account (resin RA)
Grahic Jump Location
Comparison between the Fick’s law and the measurement if the extrapolated saturation mass is taken into account (resin RA)

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