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TECHNICAL PAPERS

Evaluation of the Moisture Sensitivity of Molding Compounds of IC’s Packages

[+] Author and Article Information
H. Frémont, J. Y. Delétage, A. Pintus, Y. Danto

IXL, Université Bordeaux 1, ENSERB, CNRS UMR 5818, 351 Cours de la Libération, 33405 Talence Cedex France

J. Electron. Packag 123(1), 16-18 (Jan 01, 2000) (3 pages) doi:10.1115/1.1326436 History: Received January 01, 2000
Copyright © 2001 by ASME
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References

Figures

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SEM view of resin RA at t=0
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Resin RA: relative weight gain as a function of time and RH
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Relative weight gain as a function of time for the 3 types of PQFP’s at 80°C/85 percent RH
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Relative weight gain as a function of time for the PQFP and the pure resin (here RS) at 80°C/85 percent RH
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Maximum relative weight gain as a function of RH
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Comparison between the Fick’s law and the measurement if only the “first saturation” is taken into account (resin RA)
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Comparison between the Fick’s law and the measurement if the extrapolated saturation mass is taken into account (resin RA)

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