Daniel,
I. M., Wang,
T. M., and Gotro,
J. T., 1990, “Thermomechanical Behavior of Multilayer Structures in Microelectronics,” ASME J. Electron. Packag., 112, pp. 11–15.
Yeh,
C., Ume,
C., Fulton,
K. W., and Stafford,
J., 1993, “Correlation of Analytical and Experimental Approaches to Determine Thermally Induced PWB Warpage,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 16, No. 8, pp. 986–995.
Wu,
T. Y., Guo,
Y., and Chen,
W. T., 1993, “Thermal-Mechanical Strain Characterization for PWBs,” IBM J. Res. Dev., 37, No. 5, Sept., pp. 621–634.
Ume,
I. C., Martin,
T., and Gatro,
J. T., 1997, “Finite Element Analysis of PWB Warpage Due to the Solder Masking Process,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 20, No. 3, pp. 295–306.
Ume,
I. C., and Martin,
T., 1997, “Finite Element Analysis of PWB Warpage Due Cured Solder Mask-Sensitivity Analysis,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 20, No. 3, Sept., pp. 307–316.
Mittal,
S., Masada,
G. Y., and Bergman,
T. L., 1996, “Mechanical Response of PCB Assemblies During Infrared Reflow Soldering,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 19, No. 1, Mar., pp. 127–133.
Reddy, J. N., 1984, Energy and Variational Methods in Applied Mechanics, Wiley, New York.
Reddy,
J. N., Khdeir,
A. A., and Librescu,
L., 1987, “Levy Type Solutions for Symmetrically Laminated Rectangular Plates Using First-Order Shear Deformation Theory,” ASME J. Appl. Mech., 54, Sept., pp. 740–742.
Reddy,
J. N., and Chao,
W. C., 1981, “A Comparison of Closed-Form and Finite Element Solutions of Thick Laminated Anisotropic Plates,” Nucl. Eng. Des., 64, pp. 153–167.
Reddy, J. N., 1997, Mechanics of Laminated Composite Plates, CRC Press, New York.
Polsky, Y., and Ume, C., 1996, “An Automated System for Temperature Dependent Mechanical Property Measurements,” 1996 International Mechanical Engineering Congress and Exposition, Atlanta, GA, Nov.
