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TECHNICAL PAPERS

Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards

[+] Author and Article Information
Yarom Polsky, I. Charles Ume

School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

J. Electron. Packag 123(1), 1-5 (Nov 29, 2000) (5 pages) doi:10.1115/1.1343111 History: Received November 29, 2000
Copyright © 2001 by ASME
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References

Figures

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Young’s moduli versus temperature for FR4-7628
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Young’s moduli versus temperature for 1 Oz. Cu foil
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Maximum deflection predicted using CLT and FST versus temperature
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Distributed transverse load versus side to thickness ratio
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Maximum deflection versus side to thickness ratio at 20°C
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Maximum deflection versus side to thickness ratio at 200°C

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