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TECHNICAL PAPERS

Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards

[+] Author and Article Information
Yarom Polsky, I. Charles Ume

School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332

J. Electron. Packag 123(1), 1-5 (Nov 29, 2000) (5 pages) doi:10.1115/1.1343111 History: Received November 29, 2000
Copyright © 2001 by ASME
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References

Daniel,  I. M., Wang,  T. M., and Gotro,  J. T., 1990, “Thermomechanical Behavior of Multilayer Structures in Microelectronics,” ASME J. Electron. Packag., 112, pp. 11–15.
Yeh,  C., Ume,  C., Fulton,  K. W., and Stafford,  J., 1993, “Correlation of Analytical and Experimental Approaches to Determine Thermally Induced PWB Warpage,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 16, No. 8, pp. 986–995.
Wu,  T. Y., Guo,  Y., and Chen,  W. T., 1993, “Thermal-Mechanical Strain Characterization for PWBs,” IBM J. Res. Dev., 37, No. 5, Sept., pp. 621–634.
Ume,  I. C., Martin,  T., and Gatro,  J. T., 1997, “Finite Element Analysis of PWB Warpage Due to the Solder Masking Process,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 20, No. 3, pp. 295–306.
Ume,  I. C., and Martin,  T., 1997, “Finite Element Analysis of PWB Warpage Due Cured Solder Mask-Sensitivity Analysis,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 20, No. 3, Sept., pp. 307–316.
Mittal,  S., Masada,  G. Y., and Bergman,  T. L., 1996, “Mechanical Response of PCB Assemblies During Infrared Reflow Soldering,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 19, No. 1, Mar., pp. 127–133.
Reddy, J. N., 1984, Energy and Variational Methods in Applied Mechanics, Wiley, New York.
Reddy,  J. N., Khdeir,  A. A., and Librescu,  L., 1987, “Levy Type Solutions for Symmetrically Laminated Rectangular Plates Using First-Order Shear Deformation Theory,” ASME J. Appl. Mech., 54, Sept., pp. 740–742.
Reddy,  J. N., and Chao,  W. C., 1981, “A Comparison of Closed-Form and Finite Element Solutions of Thick Laminated Anisotropic Plates,” Nucl. Eng. Des., 64, pp. 153–167.
Reddy, J. N., 1997, Mechanics of Laminated Composite Plates, CRC Press, New York.
Polsky, Y., and Ume, C., 1996, “An Automated System for Temperature Dependent Mechanical Property Measurements,” 1996 International Mechanical Engineering Congress and Exposition, Atlanta, GA, Nov.

Figures

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Young’s moduli versus temperature for FR4-7628
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Young’s moduli versus temperature for 1 Oz. Cu foil
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Maximum deflection predicted using CLT and FST versus temperature
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Distributed transverse load versus side to thickness ratio
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Maximum deflection versus side to thickness ratio at 20°C
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Maximum deflection versus side to thickness ratio at 200°C

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