Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies

[+] Author and Article Information
Reza Ghaffarian

Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA 91109-8099e-mail: reza.ghaffarian@jpl.nasa.gov

J. Electron. Packag 122(4), 335-340 (Mar 30, 2000) (6 pages) doi:10.1115/1.1289627 History: Revised March 30, 2000
Copyright © 2000 by ASME
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Ghaffarian, R., 1988, “Ball Grid Array Packaging Guidelines,” distributed by Interconnection Technology Research Institute (ITRI), Aug. http://www.ITRI.org.
Ghaffarian, R., 2000, “Chip Scale Packaging Guidelines,” distributed by Interconnection Technology Research Institute (ITRI), http://www.ITRI.org
Ghaffarian, R., et al., 1988, “CSP Consortia Activities: Program Objectives and Status,” Surface Mount International Proceedings, Aug. 23–27, pp. 203–230.
Kapur, K. C., and Lamberson, L. R., 1977, Reliability in Engineering Desing, Wiley, New York, NY.
Martin, G., et al., 1997, “The Effect of Substrate Thickness on CBGA Fatigue Life,” Proceedings of Surface Mount International, Sept. 7–11, pp. 172–177.


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Fatigue failure projection based on the wrong failure mechanism assumption
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Daisy chain for CBGA 625 I/O
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Electrical interruptions detected with thermal cycles for CBGA 625
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Cross-sections of failure sites for CBGA 625 after 350 cycles under A and D conditions
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Cycles to failure for CBGA 625 assemblies under different cycling conditions
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Effect of temperature range on fifty percentile failure cycles for CBGA 625 and projection using modified a Coffin-Manson relationship




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