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TECHNICAL PAPERS

Accelerated Thermal Cycling and Failure Mechanisms for BGA and CSP Assemblies

[+] Author and Article Information
Reza Ghaffarian

Jet Propulsion Laboratory, California Institute of Technology, Pasadena, CA 91109-8099e-mail: reza.ghaffarian@jpl.nasa.gov

J. Electron. Packag 122(4), 335-340 (Mar 30, 2000) (6 pages) doi:10.1115/1.1289627 History: Revised March 30, 2000
Copyright © 2000 by ASME
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References

Figures

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Fatigue failure projection based on the wrong failure mechanism assumption
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Daisy chain for CBGA 625 I/O
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Electrical interruptions detected with thermal cycles for CBGA 625
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Cross-sections of failure sites for CBGA 625 after 350 cycles under A and D conditions
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Cycles to failure for CBGA 625 assemblies under different cycling conditions
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Effect of temperature range on fifty percentile failure cycles for CBGA 625 and projection using modified a Coffin-Manson relationship

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