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TECHNICAL PAPERS

An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects

[+] Author and Article Information
S. M. Heinrich, S. Shakya

Department of Civil and Environmental Engineering, Marquette University, P.O. Box 1881, Milwaukee, WI 53201-1881

J. Liang

EMC Corporation, Hopkinton, MA 01748

P. S. Lee

Rockwell Automation, 1201 S. Second Street, Milwaukee, WI 53204

J. Electron. Packag 122(4), 328-334 (Jan 28, 2000) (7 pages) doi:10.1115/1.1289631 History: Received August 01, 1999; Revised January 28, 2000
Copyright © 2000 by ASME
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References

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Heinrich, S. M., Shakya, S., Liang, J., and Lee, P. S., 1999, “An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects,” Advances in Electronic Packaging 1999, Vol. 1, ASME-EEP Vol. 26-1, pp. 43–53; presented at InterPACK ’99, Lahaina, HI, June.

Figures

Grahic Jump Location
Area-array assembly under thermal cycling. The amplitude of the shear displacement in the critical joint is umax.
Grahic Jump Location
(a) Geometric and material parameters of elastic joint; (b) depiction of elastic stiffness relationship of joint in shear
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Component and substrate parameters
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Plots of the zero-frequency “full-creep correction factor” as a function of a normalized asymptotic array stiffness. The joints in the system are assumed to be made of a general viscoelastic material.
Grahic Jump Location
Plots of the “frequency correction factor” as a function of dimensionless loading frequency for a joint of arbitrary axisymmetric shape. Joint material is assumed to be “EHKD,” i.e., to behave elastically under hydrostatic loads and as a Kelvin solid under deviatoric (pure shear) loads.
Grahic Jump Location
Plots of the “frequency correction factor” as a function of dimensionless loading frequency, using typical BGA joint shape parameters. Joint material is assumed to be “EHKD,” where K and G0 are the elastic bulk modulus and the asymptotic shear modulus.

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