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TECHNICAL PAPERS

Thermal Management of Surface Mount Power Magnetic Components

[+] Author and Article Information
G. Refai-Ahmed

Astec Advanced Power Systems Ltd., Power Group, MS. 042, 185 Corkstown Rd., Nepean, Ontario, K2H 8V4 Canada

M. M. Yovanovich

Department of Mechanical Engineering, University of Waterloo, Waterloo, Ontario, N2L 3G1 Canada

J. Electron. Packag 122(4), 323-327 (Nov 25, 1999) (5 pages) doi:10.1115/1.1289634 History: Received November 25, 1999
Copyright © 2000 by ASME
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References

Figures

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Photograph of ER package and its location on the PUPS
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Schematic diagram of numerical model of ER package (all dimensions in m)
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Relationship between R* and θ for ER14.5 with thermal underfill
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Relationship between R* and θ for ER14.5 without thermal underfill
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Comparison between numerical results and general model of ER packages with thermal underfill, Eq. (6)
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Comparison between numerical results and general model of ER packages without thermal underfill, Eq. (7)
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Schematic diagram of experimental test setup
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Comparison between experimental data and general model of ER packages, Eq. (8)

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