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TECHNICAL PAPERS

Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips

[+] Author and Article Information
T. Elperin, A. Kornilov, G. Rudin

Department of Mechanical Engineering, The Pearlstone Center for Aeronautical Engineering Studies, Ben-Gurion University of the Negev, P.O. Box 653, Beer-Sheva 84105, Israel

J. Electron. Packag 122(4), 317-322 (Aug 09, 1999) (6 pages) doi:10.1115/1.1289635 History: Received August 09, 1999
Copyright © 2000 by ASME
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References

Bar-Cohen,  A., 1992, “State-of-Art and Trends in the Thermal Packaging of Electronic Equipment,” ASME J. Electron. Packag., 114, pp. 257–270.
Suhir, E., 1988, “Thermal Stress Failures in Microelectronics Components-Review and Extension,” Advances in Thermal Modeling of Electronic Components and Systems, Vol. 1, Bar-Cohen, A., and Kraus, A. D., eds., Hemisphere, New York, pp. 373–412.
Ernsberger, F. M., 1980, “Techniques of Strengthening Glasses,” Glass: Science and Technology, Chapter 4, Uhlmann, D. R., and Kreidl, N. J., eds., Academic Press, N. J., Vol. 5, Elasticity and Strength in Glasses, pp. 133–144.
Karaev,  A., and Kornilov,  A., 1982, “Analysis of Peculiarities of the Separation Process of Semiconductor Wafers into Segments Used in the IC Technology,” Phys. Chem. Treatment Mater., 15, No. 1, pp. 64–67.
Elperin, T., Kornilov A., and Rudin, G., 1997, “Advanced Laser Technology for Precise Separation of Brittle Non-Metallic Materials,” Abstracts of the 8-th Israel Materials Engineering Conference, Beer-Sheva, April 16–17.
Elperin, T., Kornilov A., and Rudin, G., 1998, “Splitting of Non-Metallic Materials by a Double Thermal Shock Method,” Abstracts of the International Conference “Mesomechanics’98,” Tel-Aviv, p. 56.
Lumley,  R. M., 1969, “Controlled Separation of Brittle Materials Using a Laser,” Ceramic Bulletin, 48, pp. 850–854.
Powell, J., 1993, CO2-Laser Cutting, Springer-Verlag, Berlin, 246 pp.
Carslaw, H., and Jaeger, J., 1959, Conduction of Heat in Solids, Oxford University Press, London, 510 pp.
Boley, B., and Weiner, J., 1960, Theory of Thermal Stresses, Wiley, New York.

Figures

Grahic Jump Location
Different methods for separation of wafers into chips: (a)-laser scribing; (b)-dicing saw method; (c)-double thermal shock method
Grahic Jump Location
Scheme of the method for separation of wafers into chips using a surface (blind) microcrack
Grahic Jump Location
Temperature ϑ at x=0,z=d/2 versus coordinate y for different values of time t (curve 1−t=0.03 s,2−0.06 s,3−0.09 s,4−0.12 s)
Grahic Jump Location
Thermal stress σxx at the edge x=y=0 of a wafer versus time t (curve 1—the upper plane z=d/2, 2—the middle plane z=0, 3—the lower plane z=−d/2 of a wafer. Solid lines—cooling rate Ic=106 W/m2, dashed lines—cooling rate Ic=0.5×106 W/m2).

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