Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips

[+] Author and Article Information
T. Elperin, A. Kornilov, G. Rudin

Department of Mechanical Engineering, The Pearlstone Center for Aeronautical Engineering Studies, Ben-Gurion University of the Negev, P.O. Box 653, Beer-Sheva 84105, Israel

J. Electron. Packag 122(4), 317-322 (Aug 09, 1999) (6 pages) doi:10.1115/1.1289635 History: Received August 09, 1999
Copyright © 2000 by ASME
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Different methods for separation of wafers into chips: (a)-laser scribing; (b)-dicing saw method; (c)-double thermal shock method
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Scheme of the method for separation of wafers into chips using a surface (blind) microcrack
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Temperature ϑ at x=0,z=d/2 versus coordinate y for different values of time t (curve 1−t=0.03 s,2−0.06 s,3−0.09 s,4−0.12 s)
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Thermal stress σxx at the edge x=y=0 of a wafer versus time t (curve 1—the upper plane z=d/2, 2—the middle plane z=0, 3—the lower plane z=−d/2 of a wafer. Solid lines—cooling rate Ic=106 W/m2, dashed lines—cooling rate Ic=0.5×106 W/m2).




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