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TECHNICAL PAPERS

Solder Joint Reliability of Wafer Level Chip Scale Packages (WLCSP): A Time-Temperature-Dependent Creep Analysis

[+] Author and Article Information
John H. Lau, S.-W. Ricky Lee, Chris Chang

Express Packaging Systems, Inc., 1137 San Antonio Road, Palo Alto, CA 94303

J. Electron. Packag 122(4), 311-316 (May 29, 2000) (6 pages) doi:10.1115/1.1289769 History: Received August 15, 1999; Revised May 29, 2000
Copyright © 2000 by ASME
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References

Figures

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WLCSP of a peripheral-arrayed chip (in mm)
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Structural cross section of the WLCSP
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WLCSP solder bump with copper core
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Cross sections of WLCSP-PCB assembly
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WLCSP bump height and copper core height
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Shear strength of WLCSP solder bumps
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Shear fracture surfaces of WLCSP solder bumps
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Typical structure of the WLCSP solder joint
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Constitutive equation of eutectic solder with creep deformation
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Temperature profile for modeling and thermal cycling test
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Deformed shape of half of the WLCSP assembly
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Shear stress distribution in the corner solder joint
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Shear creep strain distribution in the corner solder joint
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Time-dependent shear stress at the maximum and center locations of the corner solder joint
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Time-dependent shear creep strain at the maximum and center locations of the corner solder joint
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Hysteresis loops of the shear stress and shear creep strain at the maximum and center locations of the corner solder joint
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Time-dependent creep strain energy density at the maximum and center locations of the corner solder joint
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Load-displacement curve of the WLCSP-PCB assembly under shear test
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Shear fracture surfaces of the WLCSP solder joints

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