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TECHNICAL PAPERS

Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

[+] Author and Article Information
John H. Lau, S.-W. Ricky Lee

Express Packaging Systems, Inc., 1137 San Antonio Road, Palo Alto, CA 94303

J. Electron. Packag 122(4), 306-310 (Jun 20, 2000) (5 pages) doi:10.1115/1.1289998 History: Received August 22, 1999; Revised June 20, 2000
Copyright © 2000 by ASME
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References

Figures

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Solder bumped flip chip assembly with cracks (delaminations) between underfill and solder mask. Three different kinds of PCB thickness are considered.
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Failure modes for solder bumped flip chip on PCB with imperfect underfill
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Stress-stress relations of 63Sn-37Pb solder
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Young’s modulus of 63Sn-37Pb solder
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Schematic diagram for the crack tip opening displacement (CTOD)
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Deformed shape of a solder bumped flip chip with imperfect underfill (crack length=7.5 mm)
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Typical stress and strain contours in the corner solder joint
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Maximum von Mises stress in the corner solder joint with different crack lengths
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Maximum equivalent plastic strain in the corner solder joint with different crack lengths
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Maximum shear plastic strain in the corner solder joint with different crack lengths
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Strain energy release rate at the crack tip of the interface between the underfill and solder mask with different crack lengths
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Phase angle at the crack tip of the interface between the underfill and solder mask with different crack lengths

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