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TECHNICAL PAPERS

Fracture Mechanics Analysis of Low Cost Solder Bumped Flip Chip Assemblies With Imperfect Underfills

[+] Author and Article Information
John H. Lau, S.-W. Ricky Lee

Express Packaging Systems, Inc., 1137 San Antonio Road, Palo Alto, CA 94303

J. Electron. Packag 122(4), 306-310 (Jun 20, 2000) (5 pages) doi:10.1115/1.1289998 History: Received August 22, 1999; Revised June 20, 2000
Copyright © 2000 by ASME
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References

Lau, J. H., 2000, Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies, McGraw-Hill, New York, NY.
Lau,  J. H., and Lee,  S. W. R., 2000, “Effects of Underfill Delamination and Chip Size on the Reliability of Solder Bumped Flip Chip on Board,” IMAPS Trans. Int. J. Microelectron. Electron. Packag., 23, No. 1, pp. 33–39.
Lau, J. H., and Lee, S. W. R., 1999, Chip Scale Package: Design, Materials, Process, Reliability, and Applications, McGraw-Hill, New York, NY.
Lau, J. H., and Pao, Y. H., 1997, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York, NY.
Hutchinson,  J. W., and Suo,  Z., 1992, “Mixed Mode Cracking in Layered Materials,” Adv. Appl. Mech., 29, pp. 64–187.
Rice,  J. R., 1988, “Elastic Fracture Mechanics Concepts for Interfacial Cracks,” ASME J. Appl. Mech., 55, pp. 98–103.
Malyshev,  B. M., and Salganik,  R. L., 1965, “The Strength of Adhesive Joints Using the Theory of Cracks,” Int. J. Fract. Mech., 1, pp. 114–128.

Figures

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Solder bumped flip chip assembly with cracks (delaminations) between underfill and solder mask. Three different kinds of PCB thickness are considered.
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Failure modes for solder bumped flip chip on PCB with imperfect underfill
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Stress-stress relations of 63Sn-37Pb solder
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Young’s modulus of 63Sn-37Pb solder
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Schematic diagram for the crack tip opening displacement (CTOD)
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Deformed shape of a solder bumped flip chip with imperfect underfill (crack length=7.5 mm)
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Typical stress and strain contours in the corner solder joint
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Maximum von Mises stress in the corner solder joint with different crack lengths
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Maximum equivalent plastic strain in the corner solder joint with different crack lengths
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Maximum shear plastic strain in the corner solder joint with different crack lengths
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Strain energy release rate at the crack tip of the interface between the underfill and solder mask with different crack lengths
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Phase angle at the crack tip of the interface between the underfill and solder mask with different crack lengths

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