Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

[+] Author and Article Information
A. Q. Xu, H. F. Nied

Department of Mechanical Engineering and Mechanics, Lehigh University, Bethlehem, PA 18015-3085

J. Electron. Packag 122(4), 301-305 (Dec 01, 2000) (5 pages) doi:10.1115/1.1289768 History:
Copyright © 2000 by ASME
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Tummala, R. R., Rymaszewski, E. J., and Klopfenstein, A. G., eds., 1997, Microelectronics Packaging Handbook, Chapman & Hall, New York.
Hattori,  T., Sakata,  S., and Murakami,  G., 1989, “A stress singularity parameter approach for evaluating the interfacial reliability of plastic encapsulated lsi devices,” ASME J. Electron. Packag., 111, pp. 243–248.
Gradin,  P. A., 1982, “A fracture criterion for edge-bonded bimaterial bodies,” J. Compos. Mater., 16, pp. 448–456.
Groth,  H. L., 1988, “Stress singularities and fracture at interface corners in bonded joints,” Int. J. Adhesion Adhesives, 8, pp. 107–113.
Reedy,  E. D., and Guess,  T. R., 1993, “Comparison of butt tensile strength data with interface corner stress intensity factor prediction,” Int. J. Solids Struct., 30, No. 21, pp. 2929–2936.
Yamada, Y. and Okumura, H., 1983, “Analysis of local stress in composite materials by the 3d finite element,” Kawata, K., and Akasaka, T., eds., Proc. of the Japan-U.S. Conference, 1981, pp. 55–64.
Lehoucq, R. B., Sorensen, D. C., and Yang, C. 1997, ARPACK Users Guide: Solution of Large Scale Eigenvalue Problems by Implicitly Restarted Arnoldi Methods, http://www.caam.rice.edu/software/ARPACK/.
Palmer, C. I., and Leigh, C. W., eds., 1925, Plane and Sperical Trigonometry, 3rd ed., McGraw-Hill, New York.


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Schematic of a flip chip assembled chip-on-board package
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Schematic of a FCOB package illustrating potential cracking locations at corners and edges
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Illustration of the finite element discretization
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A typical model of the corner contact geometry (a) and its mesh (b) for the FR4/epoxy intersection, i.e., site F in Fig. 2
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Results for the upper silicon die/epoxy fillet edge (site A) and corner (site D) in Fig. 2. σ∼ρλ−1.
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Results for the FR4/epoxy edge (site C) and corner (site F) in Fig. 2. σ∼ρλ−1.
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Comparison of the effects of two glass fiber orientations in FR4. σ∼ρλ−1.
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Results for continuously changing glass fiber orientation. σ∼ρλ−1.



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