Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

[+] Author and Article Information
A. Q. Xu, H. F. Nied

Department of Mechanical Engineering and Mechanics, Lehigh University, Bethlehem, PA 18015-3085

J. Electron. Packag 122(4), 301-305 (Dec 01, 2000) (5 pages) doi:10.1115/1.1289768 History:
Copyright © 2000 by ASME
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Tummala, R. R., Rymaszewski, E. J., and Klopfenstein, A. G., eds., 1997, Microelectronics Packaging Handbook, Chapman & Hall, New York.
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Schematic of a FCOB package illustrating potential cracking locations at corners and edges
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Illustration of the finite element discretization
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A typical model of the corner contact geometry (a) and its mesh (b) for the FR4/epoxy intersection, i.e., site F in Fig. 2
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Results for the upper silicon die/epoxy fillet edge (site A) and corner (site D) in Fig. 2. σ∼ρλ−1.
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Results for the FR4/epoxy edge (site C) and corner (site F) in Fig. 2. σ∼ρλ−1.
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Comparison of the effects of two glass fiber orientations in FR4. σ∼ρλ−1.
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Results for continuously changing glass fiber orientation. σ∼ρλ−1.
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Schematic of a flip chip assembled chip-on-board package




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