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TECHNICAL PAPERS

Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

[+] Author and Article Information
B. Han

Department of Mechanical Engineering, University of Maryland, College Park, MD 20742

P. Kunthong

Mechanical Engineering Department, Clemson University, Clemson, SC 29634

J. Electron. Packag 122(4), 294-300 (May 15, 2000) (7 pages) doi:10.1115/1.1290000 History: Revised May 15, 2000
Copyright © 2000 by ASME
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References

Darveaux, R., and Banerji, K., 1991, “Fatigue Analysis of Flip Chip Assemblies Using Thermal Stress Simulations and a Coffin-Manson Relation,” Proceedings of the 41st Electronic Components and Technology Conference, pp. 797–805.
Tsukada, Y., Mashimoto, Y., Nishio, T., and Mii, N., 1992, “Reliability and Stress of Encapsulated Flip Chip Joint on Epoxy Base Printed Circuit Board,” Proceedings of the Advances in Electronic Packaging, ASME, pp. 827–835.
Powell, D., and Trivedi, A., 1993, “Flip-Chip on FR4 Integrated Circuit Package,” Proceedings of the 43rd Electronic Components and Technology Conference, pp. 182–186.
Semiconductor Industry Association, 1997, The National Technology Roadmap for Semiconductors, SIA.
Tsukada, Y., 1994, “Chapter 9: Solder Bumped Flip Chip Attach on SLC Board and Multichip Module,” Chip on Board, Lau, J. H., ed., Van Nostrand Reinhold, pp. 410–443.
Han,  B., 1992, “High Sensitivity Moiré Interferometry for Micromechanics Studies,” Opt. Eng., 31, No. 7, pp. 1517–1526.
Post, D., Han, B., and Ifju, P., 1994, High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials, Springer-Verlag, NY.
Han,  B., and Post,  D., 1992, “Immersion Interferometer for Microscopic Moiré Interferometry,” Exp. Mech., 32, No. 1, pp. 38–41.
Han, B., Guo, Y., and Caletka, D., 1995, “On the Effect of Moiré Specimen Preparation on Solder Ball Strains of Ball Grid Array Package Assembly,” Proceedings of the 1995 SEM Spring Conference on Experimental Mechanics, Grand Rapid, MI.
Verma, K., Kunthong, P., and Han, B., 1998, “Thermo-Mechanical Strains of Flip-Chip Solder Bumps on Organic PCB Substrate,” Proceedings of the International Mechanical Engineering Congress and Exposition, ASME Winter Meeting, Anaheim, CA.
Post,  D., and Wood,  J., 1989, “Determination of Thermal Strains by Moiré Interferometry,” Exp. Mech., 29, No. 3, pp. 318–322.
Guo,  Y., Lim,  C. K., Chen,  W. T., and Woychik,  C. G., 1993, “Solder Ball Connect (SBC) Assemblies Under Thermal Loading: I. Deformation Measurement via Moiré Interferometry, and its Interpretation,” IBM J. Res. Dev., 37, No. 5, pp. 635–648.
Han,  B., 1997, “Deformation Mechanism of Two-Phase Solder Column Interconnections Under Highly Accelerated Thermal Cycling Condition: An Experimental Study,” ASME J. Electron. Packag., 119, pp. 189–196.
Suryanarayana,  D., Hsisa,  R., and Gall,  T. P., J. M., 1991, “Enhancement of Flip-Chip Fatigue Life by Encapsulation,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 14, No. 1, pp. 218–223.
Suryanarayana,  D., Wu,  T. W., and Varcoe,  J. A., 1993, “Encapsultants Used in Flip-Chip Packages,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 16, No. 8, pp. 858–862.
Wang,  D. W., and Papathomas,  K. I., 1993, “Encapsulant for Fatigue Life Enhancement of Controlled-Collapse Chip Connection (C4),” IEEE Trans. Compon., Hybrids, Manuf. Technol., 16, No. 8, pp. 863–867.
Zheng, W. C., Harren, S. V., and Skipor, A. F., 1994, “Thermo-Mechanical Analysis of Flip-Chip on Board Electronic Packaging Assembly,” Presented at the 1994 International Mechanical Engineering Congress & Exhibition, ASME, Chicago, IL, Nov. 6–11.
Han, B., Chopra, M., Park, S.-B., Li, L., and Verma, K., 1996, “Effect of Substrate CTE on Solder Ball Reliability of Flip Chip Ball Grid Array Package Assembly,” Proceedings of the 1996 Surface Mount International Conference, SMT, San Jose, CA, pp. 43–52.
Hecht, E., 1987, Optics, Addison-Wesley, Reading, MA.

Figures

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Schematic diagram of surface laminar circuit substrate (after Tsukada 5)
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Schematic diagram of (a) a flip chip assembly on a SLC substrate, (b) the assembly inserted in a precision vise, and (c) the assembly after specimen preparation
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Micrographs of the region of interest
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Microscopic U and V displacement fields of the region of interest shown in Fig. 3: (a) bare substrate, (b) flip chip assembly, and (c) flip chip assembly after canceling rigid-body rotation. The contour interval is 104 nm per fringe.
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Microscopic U and V displacement fields of the region, marked by the dashed box in Fig. 3, with a higher sensitivity: (a) bare substrate and (b) flip chip assembly. The contour interval is 52 nm per fringe.
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(a) Deformed shape of the surface laminar layer and (b) average shear strain distribution as a function of DNP
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Stress-induced strain distributions through the thickness of the photosensitive dielectric layer (AA)
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Stress-induced strain distributions along the solder resist mask (BB)
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(a) Deformed shape of the metal via segment CC in the flip chip assembly and (b) shear strain distribution along CC
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Effect of the CTE mismatch between the chip and the substrate

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