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TECHNICAL BRIEFS

Tools for Stress Analysis of Microelectronic Structures

[+] Author and Article Information
Boris Mirman

Weidlinger Associates Inc, Consulting Engineers, One Broadway, 11th Floor, Cambridge, MA 02142-1100

J. Electron. Packag 122(3), 280-282 (Dec 11, 1998) (3 pages) doi:10.1115/1.1286104 History: Received June 10, 1998; Revised December 11, 1998
Copyright © 2000 by ASME
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References

Orringer, O. and Tong, P., 1984, “Uses and abuses of the finite element method,” Proceedings of SPIE, the International Society for Optical Engineering, Vol. 450, Bellingham, Washington, DC, pp. 2–33.
Subbarayan,  G., Ramakrishna,  K., and Sammakia,  B. G., 1997, “The Impact of Interfacial Adhesion on PTH and Via Stress State,” ASME J. Electron. Packag., 119, pp. 260–267.
Engelmaier,  W., 1988, “Plated Through Hole Failures in Thermal Cycling: Analytical Considerations,” Technical Report IPC-TR-579, Lincolnwood, IL.
Mirman,  B., 1988, “Mathematical Model of a Plated-Through Hole under a Load Induced by Thermal Mismatch,” IEEE Trans., CHMT, 11, No. 4, pp. 506–511.
Safranek, W. H., 1986, “The Properties of Electrodeposited Metals and Alloys,” American Electroplaters and Surface Finishers Society, Handbook.

Figures

Grahic Jump Location
PTH finite element model (Subbarayan et al. 2)
Grahic Jump Location
PTH stress model (Engelmaier 3)
Grahic Jump Location
PTH stress model (Mirman 4)
Grahic Jump Location
Cross-sections of plated-through hole

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