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TECHNICAL BRIEFS

Lead-On-Chip Versus Chip-On-Lead Packages and Solder Failure Criteria

[+] Author and Article Information
Boris Mirman

Weidlinger Associates Inc, Consulting Engineers, One Broadway, 11th Floor, Cambridge MA 02142-1100

J. Electron. Packag 122(3), 279-280 (Jan 09, 2000) (2 pages) doi:10.1115/1.1286105 History: Received July 09, 1998; Revised January 09, 2000
Copyright © 2000 by ASME
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References

Tsao,  P.-H., Chang,  L. C., Chen,  T. C., Haung,  C., and Chen,  C. Z., 1998, “Investigation of the Lead-On-Chip Package’s Reliability,” ASME J. Electron. Packag., 120, pp. 171–174.
Visvanadham, P., Stennett, M., Emerick, A., and Haggett, R., 1993, “Second Level Assembly and Reliability Aspect of TSOPs,” Proc. of ASME-EEP, Sept., 1127–1134.
The American Society for Metals, 1948, “Metals Handbook,” 1948 Edition, p. 1144.
Engelmaier, W., and Fuentes, B., 1995, “Alloy-42—a Material To Be Avoided for Surface Mount Component Leads and Lead Frames,” NEPCON-West, pp. 1730–1742.
Engelmaier,  W., 1983, “Fatigue Life of LLCC Solder Joints During Power Cycling,” CHMT, 6, No. 3, Sept.
Engelmaier, W., 1984, “Functional Cycling and SM Attachment Reliability,” ISHM Technical Monograph Series, 6984-002, pp. 84–114.
Solomon, H. D., 1986, “Creep, Strain Rate Sensitivity, and Low-Cycle Fatigue of 60-40 Solder,” GE Technical Information Series, Sept.
Shine, M. C., and Fox, L. R., 1987, “Fatigue of Solder Joints in Surface Mount Devices,” Low Cycle Fatigue—ASTM Special Technical Publication 942, 588–610.
Iannuzzelli, R., 1990, “Validation of Module Assembly Physical Models,” 40th ECTC, May 21–23.
Knecht, S., and Fox, L., 1991, “Integrated Matrix Creep: Application to Accelerated Testing and Lifetime Prediction,” Solder Joint Reliability, Ed. J. H. Lau.
Knecht, S., 1990, “Integrated Matrix Creep: Application to Lifetime Prediction of Eutectic Tin-Lead Solder Joints,” Mater. Res. Soc. Symp. Proc.
Mohr,  O., 1900, “Welche Umstäande bedingen die Elastizitätgrenze und den Bruch eines Materials?” Zeitschrift des Vereines deutscher Ingenieure, 44, pp. 1524–1530.

Figures

Grahic Jump Location
Directions of forces and moments applied to TSOP’s leads
Grahic Jump Location
Bowing of free TSOPs under cooling

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