0
TECHNICAL PAPERS

A Reexamination of Residual Stresses in Thin Films and of the Validity of Stoney’s Estimate

[+] Author and Article Information
C. Y. Hui, H. D. Conway, Y. Y. Lin

Department of Theoretical and Applied Mechanics, Cornell University, Ithaca, NY 14853

J. Electron. Packag 122(3), 267-273 (Sep 01, 2000) (7 pages) doi:10.1115/1.1287930 History:
Copyright © 2000 by ASME
Your Session has timed out. Please sign back in to continue.

References

Frank,  F. C., and Van Der Merwe,  J. H., 1949, “One Dimensional Dislocation II. Misfitting Monolayers and Oriented Overgrowth,” Proc. R. Soc. London Series A, 198, pp. 216–225.
Doerner,  F. M., and Nix,  D. W., 1988, “Stresses and Deformation Processes in Thin Films on Substrates,” CRC Crit. Rev. Solid State Mater. Sci., 14, No. 13, pp. 225–268.
Nix,  W. D., 1989, “Mechanical Properties of Thin Films,” Metall. Trans., 20A, pp. 2217–2245.
Thouless,  M. D., Olsson,  E., and Gupta,  A., 1992, “Cracking of Brittle Films on Elastic Substrates,” Acta Metall. Mater., 40, No. 6, pp. 1287–1292.
Thouless,  M. D., Hutchinson,  J. W., and Liniger,  E. G., 1992, “Plane-Strain, Buckling-Driven Delamination of Thin Films: Model Experiments and Mode II Fracture,” Acta Metall. Mater., 40, No. 10, pp. 2639–2649.
Evans,  A. G., and Hutchinson,  J. W., 1994, “On the Mechanics of Delamination and Spalling in Compressed Films,” Int. J. Solids Struct., 20, No. 5, pp. 455–466.
Drory,  D. M., and Evan,  A. G., 1990, “Experimental Observations of Substrate Fracture Caused by Residual Stressed Films,” J. Am. Ceram. Soc., 73, No. 3, pp. 634–638.
Evans,  A. G., and Hu,  M. S., 1989, “The Cracking and Decohesion of Thin Films on Ductile Substrates,” Acta Metall., 37, No. 3, pp. 917–925.
Hu,  M. S., Thouless,  M. D., and Evans,  A. G., 1988, “The Decohesion of Thin Films from Brittle Substrates,” Acta Metall., 36, No. 5, pp. 1301–1307.
Hutchinson,  J. W., and Suo,  Z., 1992, “Mixed Mode Cracking in Layered Materials,” Adv. Appl. Mech., 29, pp. 63–191.
Jiao,  J., Gurumurthy,  C. K., Kramer,  E. J., Sha,  Y., Hui,  C. Y., and Borgesen,  P., 1998, “Measurement of Interfacial Fracture Toughness under Combined Mechanical and Thermal Stresses,” ASME J. Electron. Packag., 120, pp. 349–353.
Doerner,  F. M., Gardner,  D. S., and Nix,  D. W., 1986, “Plastic Properties of Thin Films on Substrates as Measured by Submicron and Substrate Curvature Techniques,” J. Mater. Res., 1, No. 6, pp. 845–851.
Thouless,  M. D., Gupta,  J., and Harper,  J. M. E., 1993, “Stress Development and Relaxation in Copper Films During Thermal Cycling,” J. Mater. Res., 8, No. 6, pp. 1845–1852.
Dempsey,  J. P., and Sinclair,  G. B., 1979, “On the Stress Singularities in the Plane Elasticity of the Composite Wedge,” J. Elast., 9, pp. 373–391.
Bogy,  D. B., 1971, “Two Edge-Bonded Elastic Wedges of Different Materials and Wedge Angles Under Surface Tractions,” ASME J. Appl. Mech., 94, pp. 377–386.
Stoney,  G. G., 1909, “The Tension of Metallic Films Deposited by Electrolysis,” Proc. Roy. Soc. London A Math., 82, pp. 172–175.
Liu,  X. H., Suo,  Z., and Ma,  Q., 1998, “Split Singularities: Stress Field Near the Edge of Silicon Die on Polymer Substrate,” Acta Metall., 47, No. 1, pp. 67–76.
Suo,  Z., and Hutchinson,  J. W., 1990, “Interface Cracks Between Two Elastic Layers,” Int. J. Fract., 43, pp. 1–18.
Suo,  Z., and Hutchinson,  J. W., 1989, “Steady-State Cracking in Brittle Substrate Beneath Adherent Films,” Int. J. Solids Struct., 25, No. 11, pp. 1337–1353.

Figures

Grahic Jump Location
Geometry of two-layer system
Grahic Jump Location
Schematic of internal stresses in composite
Grahic Jump Location
Schematic of final stress state as superposition of two stress states
Grahic Jump Location
Polar coordinate system for the analysis of local stress state near the edge
Grahic Jump Location
Shear and normal stresses at ends of composite. These stresses are statically equivalent to the force F and moment M.
Grahic Jump Location
Free body diagram of film and substrate
Grahic Jump Location
(a) Comparison of film stresses (40) with those obtained from Stoney formula (14b). ω=Ef/Es and δ=hf/hs. (b) Comparison of film stresses (13b) with those obtained from Stoney formula (14b). ω=Ef/Es and δ=hf/hs.
Grahic Jump Location
Elastic-plastic behavior of film material
Grahic Jump Location
Schematic of energy release rate calculation
Grahic Jump Location
Propagation of interface crack into substrate

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In