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TECHNICAL PAPERS

A Study of Process-Induced Residual Stress in PBGA Packages

[+] Author and Article Information
Zhu Wu, Jian Lu

Laboratory of Mechanical Systems and Concurrent Engineering (LASMIS), Universite de Technologie de Troyes, 12 rue Marie Curie, BP 2060, 10010 Troyes, Francee-mail: lu@univ-troyes.fr

Yifan Guo

Packaging Mechanics, Semiconductor Products Sector, Motorola, 2100 East Elliot Road, Tempe, AZ 85284

J. Electron. Packag 122(3), 262-266 (Dec 08, 1999) (5 pages) doi:10.1115/1.1285983 History: Received April 20, 1999; Revised December 08, 1999
Copyright © 2000 by ASME
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References

Figures

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A cross section of the plastic ball grid array packaging
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Three-dimensional finite element to determine the calibration coefficients for PBGA packages by using equibiaxial stress field. (a) A 3-D finite element model, (b) deformed shape, (c) surface strain field ε11, (d) surface displacement field, u1.
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Distributions of surface radial displacements on the circle r=1.2r0, for an assumed arbitrary uniform residual stress field calculated by using two methods: the coefficient-calibration method and the direct FEM method
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Ux and Uy fringe patterns obtained from the PBGA packages A and B, when a blind hole was drilled throughout the plastic molding compound; hole radius, r0=1.0 mm and hole depth, h=0.4 mm
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Ux and Uy fringe patterns obtained from the PBGA package B, when a blind hole was drilled by two steps hole drilling with identical increment throughout the chip carrier; hole radius, r0=1.0 mm and hole drilling increment, Δh=0.3 mm
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Magnified view of Ux fringe pattern of the PBGA package B
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Average values of residual stresses in the plastic molding compound of the PBGA packages A and B
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Average values of residual stresses in the chip carrier of the PBGA package B

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