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TECHNICAL PAPERS

CBGA Solder Joint Reliability Evaluation Based on Elastic-Plastic-Creep Analysis

[+] Author and Article Information
John H. L. Pang, C. W. Seetoh

School of Mechanical and Production Engineering, Nanyang Technological University, Nanyang Drive, Singapore 639798

Z. P. Wang

Gintic Institute of Manufacturing Technology, Nanyang Drive, Singapore 638075

J. Electron. Packag 122(3), 255-261 (Sep 01, 2000) (7 pages) doi:10.1115/1.1286120 History:
Copyright © 2000 by ASME
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References

Figures

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One-eighth 3D finite element model for CBGA package
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“Full Creep” analysis method in relation to temperature cycling profile
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Plot of creep strain during various stages of temperature cycling loading for “Full Creep” analysis
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A typical CBGA test board used for reliability tests
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Plot of Weibull failure distribution for CBGA solder joints subject to thermal cycling
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Cross-section of CBGA solder joint before test
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Cross-section of CBGA solder joint after thermal cycling test
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“Dwell Creep” analysis method in relation to temperature cycling profile
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Effect of stress on creep strain rate with respect to temperature
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Effect of temperature on creep strain rate with respect to stress
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Schematic diagram of CBGA solder joint section
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Ceramic ball grid array package used (dimensions in mm)
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Plot of equivalent creep strain versus time increment for “Dwell Creep” analysis
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Plot of equivalent plastic strain versus time increment for “Dwell Creep” analysis
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Plot of equivalent von Mises stress versus time increment for “Dwell Creep” analysis
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Plot of equivalent von Mises stress versus equivalent creep strain for “Dwell Creep” analysis
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Plot of equivalent von Mises stress versus equivalent plastic strain for “Dwell Creep” analysis
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Simulation of temperature cycling loading profile for 3 cycles
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Finite element mesh details of solder balls in one-eighth 3D model
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Plot of equivalent creep strain versus time increment for “Full Creep” analysis
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Plot of equivalent von Mises stress versus equivalent plastic strain for “Full Creep” analysis
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Plot of equivalent von Mises stress versus equivalent creep strain for “Full Creep” analysis
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Plot of equivalent von Mises stress versus time increment for “Full Creep” analysis
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Plot of equivalent plastic strain versus time increment for “Full Creep” analysis

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