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TECHNICAL PAPERS

Optimization of Pin-Fin Heat Sinks for Impingement Cooling of Electronic Packages

[+] Author and Article Information
Y. Kondo, H. Matsushima, T. Komatsu

Mechanical Engineering Research Laboratory, Hitachi, Ltd., Tsuchiura, Ibaraki, 300, Japan

J. Electron. Packag 122(3), 240-246 (Feb 15, 2000) (7 pages) doi:10.1115/1.1289761 History: Received August 03, 1998; Revised February 15, 2000
Copyright © 2000 by ASME
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References

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Figures

Grahic Jump Location
Parameters of pin-fin geometries and zonal model for thermal resistance and pressure drop. (a) bird’s-eyeview; (b) side view.
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Effects of gap between orifice and fin-top on flow visualization. (a) G=0 mm; (b) G=2 mm; (c) G=7 mm.
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Effects of pin diameter on both thermal resistance and pressure drop and comparison of model predictions with experimental data. (a) thermal resistance; (b) pressure drop.
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Effects of inlet-orifice diameter on thermal resistance for constant pumping power
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Assumed variation of relative cost with size parameter

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