Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

[+] Author and Article Information
J. R. Culham, M. M. Yovanovich

Microelectronics Heat Transfer Laboratory, Department of Mechanical Engineering, University of Waterloo, Waterloo, Canada

T. F. Lemczyk

Louisiana State University, Baton Rouge, LA 70821

J. Electron. Packag 122(3), 233-239 (Sep 01, 2000) (7 pages) doi:10.1115/1.1287928 History:
Copyright © 2000 by ASME
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
Multiple layer substrate
Grahic Jump Location
Various package geometries reproduced from sketches in Bar-Cohen 11
Grahic Jump Location
Coordinate system for package model
Grahic Jump Location
Die plane control surfaces; (a) single source, (b) multiple sources
Grahic Jump Location
Conductive and radiative heat transfer paths in an open cavity package
Grahic Jump Location
Profiles of packages used for model validation; (a) validation chip module, (b) 208 pin plastic quad flat pack, (c) cavity up multichip module




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In