Fatigue Life Analysis of Solder Joints in Flip Chip Bonding

[+] Author and Article Information
Yutaka Tsukada, Hideo Nishimura

Yasu Technology Application Laboratory, IBM, 800 Ichimiyake, Yasu-cho, Yasu-gun, Shiga-ken 520-23 Japan

Masao Sakane, Masateru Ohnami

Department of Mechanical Engineering, Faculty of Science and Engineering, Ritsumeikan University, 1916 Noji-cho, Kusatsu-shi, Shiga-ken 525 Japan

J. Electron. Packag 122(3), 207-213 (Nov 01, 1999) (7 pages) doi:10.1115/1.1286002 History: Received November 01, 1997; Revised November 01, 1999
Copyright © 2000 by ASME
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Nakano, F., Soga, T., and Amagi, S., 1987, “Resin-Insertion Effect on Thermal Cycle Resistivity of Flip-Chip Mounted LSI Devices,” Proceedings of ISHM’87, pp. 536–541.
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Flip chip bonding cross section
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Shape and dimensions of test chip
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Shape and dimensions of test carrier
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Flow of building test sample
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Shape and dimensions of solder joint
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Four-points D.C. potential measurement
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Stress test results in cumulative failure rate
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Joint resistance increase. (a) Encapsulated; (b) unencapsulated
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3D diagram of resistance change. (a) Encapsulated; (b) unencapsulated
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Photographs of failed joints. (a) Encapsulated; (b) magnified; (c) unencapsulated
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3D models used for FEM analysis. (a) Unencapsulated; (b) unencapsulated—full joint; (c) encapsulated—single joint; (d) joint for analysis
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Package deformation. (a) Encapsulated; (b) unencapsulated
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Maximum Mises strain in d18 joint
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Variation of Mises strain with distance from chip center. (a) Encapsulated; (b) unencapsulated
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Mises strain distribution. (a) Encapsulated; (b) unencapsulated
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Relationship between Mises strain amplitude and stress cycles



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