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TECHNICAL PAPERS

A Damage Evolution Model for Thermal Fatigue Analysis of Solder Joints

[+] Author and Article Information
Xiaowu Zhang

APDS Department, Institute of Microelectronics, Singapore Science Park II, Singapore 117685

S-W. Ricky Lee

Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong

Yi-Hsin Pao

Materials Engineering Department, Visteon Automotive Systems, Dearborn, MI 48121-6231

J. Electron. Packag 122(3), 200-206 (Oct 31, 1999) (7 pages) doi:10.1115/1.1286121 History: Received January 15, 1999; Revised October 31, 1999
Copyright © 2000 by ASME
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References

Figures

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Experimental creep hysteresis loops of 63Sn/37Pb under thermal cycling between 40 and 140°C (Lau and Pao 8)
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Least square curve fitting for damage evolution function
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Finite element mesh of the double-beam specimen
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Comparison of creep hysteresis loops between testing (Lau and Pao 8) and simulation
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Time history of shear stress in the solder joint for 100 thermal cycles
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Time history of creep shear strain in the solder joint for 100 thermal cycles
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Contour of creep strain energy density in the solder joint of double-beam specimen
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Time history of creep strain energy density evaluated at the center of the solder joint of double-beam specimen
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Finite element mesh for a 272 PBGA-PCB assembly
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Creep strain energy density distribution in the PBGA-PCB assembly
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Contour of creep strain energy density in the critical solder joint of PBGA-PCB assembly
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Time history of creep strain energy density evaluated at the center of the critical solder joint of the PBGA-PCB assembly
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Finite element mesh for a BLP-PCB assembly
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Contour of creep strain energy density in the critical solder joint of BLP-PCB assembly
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Time history of creep strain energy density evaluated at the center of the critical solder joint of the BLP-PCB assembly

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