0
TECHNICAL PAPERS

Stress Analysis of Thermal Inclusions With Interior Voids and Cracks

[+] Author and Article Information
C. Q. Ru

Department of Mechanical Engineering, University of Alberta, Edmonton, Canada T6G 2G8e-mail: c.ru@ualberta.ca

J. Electron. Packag 122(3), 192-199 (Aug 30, 1999) (8 pages) doi:10.1115/1.1286020 History: Received June 23, 1998; Revised August 30, 1999
Copyright © 2000 by ASME
Your Session has timed out. Please sign back in to continue.

References

Hu,  S. M., 1991, “Stress-related problems in silicon technology,” J. Appl. Phys., 70, pp. R53–R80.
Bar-Cohen,  A., 1992, “State of the art and trends in the thermal packaging of electronic equipment,” ASME J. Electron. Packag., 114, pp. 257–270.
Okabayashi,  H., 1993, “Stress-induced void formation in metallization for integrated circuits,” Mater. Sci. Eng., R., 11, pp. 191–241.
Hu,  C. K., Rodbell,  K. P., Sullivan,  T. D., Lee,  K. Y., and Bouldin,  D. P., 1995, “Electromigration and stress-induced voiding in fine Al and al-alloy thin film lines,” IBM J. Res. Dev., 39, pp. 465–497.
Suhir,  E., 1998, “The future of microelectronics and photonics and the role of mechanics and materials,” ASME J. Electron. Packag., 120, pp. 1–11.
Hu,  S. M., 1990, “Stress from isolation trenches in silicone substrates,” J. Appl. Phys., 67, pp. 1092–1101.
Niwa,  H., Yagi,  H., Tsuchikawa,  H., and Kato,  M., 1990, “Stress distribution in an aluminum interconnect of very large scale integration,” J. Appl. Phys., 68, pp. 328–333.
Wu,  C. H., and Chen,  C. H., 1990, “A crack in a confocal elliptic inhomogeneity embedded in an infinite medium,” ASME J. Appl. Mech., 57, pp. 91–96.
Muller,  W. H., and Schmauder,  S., 1992, “On the behavior of r- and θ-cracks in composite materials under thermal and mechanical loading,” Int. J. Solids Struct., 29, pp. 1907–1918.
Seo,  K., and Mura,  T., 1979, “The elastic field in a half-space due to ellipsoidal inclusion with uniform dilatational eigenstrains,” ASME J. Appl. Mech., 46, pp. 568–572.
Chiu,  Y. P., 1980, “On the internal stresses in a half-plane and a layer containing localized inelastic strains or inclusions,” ASME J. Appl. Mech., 47, pp. 313–318.
Hu,  S. M., 1989, “Stress from a parallelepipedic thermal inclusion in a semispace,” J. Appl. Phys., 66, pp. 2741–2743.
Muller,  W. H., Harris,  D. O., and Dedhia,  D., 1994, “Stress intensity factors of two-dimensional and three-dimensional cracks next to a thermally mismatch inclusion,” ASME J. Appl. Mech., 61, pp. 731–735.
Muskhelishvili, N. I., 1963, “Some basic problems of the mathematical theory of elasticity,” P. Noordhoff Ltd., Netherlands.
Savin, G. N., 1961, Stress concentration around holes, Pergamon Press.
Sih, G. C., 1973, Handbook of stress-intensity factors. Institute of fracture and solid mechanics, Lehigh University Press, Lehigh, PA.
Arzt,  E., Kraft,  O., Nix,  W. D., and Sanchez,  J. E., 1994, “Electromigration failure by shape change of voids in bamboo lines,” J. Appl. Phys., 76, pp. 1563–1571.
Kraft,  O., and Arzt,  E., 1995, “Numerical simulation of electromigration-induced shape changes of voids in bamboo lines,” Appl. Phys. Lett., 66, pp. 2063–2065.
Rose,  J. H., 1992, “Fatal electromigration voids in narrow aluminum-copper interconnect,” Appl. Phys. Lett., 61, pp. 2170–2172.
Maroudas,  D., 1995, “Dynamics of transgranular voids in metallic thin films under electromigration conditions,” Appl. Phys. Lett., 67, pp. 798–800.
Kantorovich, L. V., and Krylov, V. I., 1958, Approximate methods of higher analysis, Interscience Publishers.
Ru,  C. Q., and Schiavone,  P., 1996, “On the elliptic inclusion in anti-plane shear,” Math. Mech. Solids, 1, pp. 327–333.
Ru,  C. Q., 1999, “Analytic solution for Eshelby’s problem of an inclusion of arbitrary shape in a plane or half-plane,” ASME J. Appl. Mech., 66, pp. 315–322.

Figures

Grahic Jump Location
A thermal inclusion of arbitrary shape with internal or nearby voids and cracks
Grahic Jump Location
The reduced problem (2.132.142.15) of a homogeneous elastic plane containing the same voids and cracks
Grahic Jump Location
Several typical shapes of thermal inclusion with internal void or crack (a) Elleptic thermal inclusion; (b) triangle thermal inclusion; (c) rectangular thermal inclusion

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In