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TECHNICAL PAPERS

Stress Analysis of Thermal Inclusions With Interior Voids and Cracks

[+] Author and Article Information
C. Q. Ru

Department of Mechanical Engineering, University of Alberta, Edmonton, Canada T6G 2G8e-mail: c.ru@ualberta.ca

J. Electron. Packag 122(3), 192-199 (Aug 30, 1999) (8 pages) doi:10.1115/1.1286020 History: Received June 23, 1998; Revised August 30, 1999
Copyright © 2000 by ASME
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References

Figures

Grahic Jump Location
Several typical shapes of thermal inclusion with internal void or crack (a) Elleptic thermal inclusion; (b) triangle thermal inclusion; (c) rectangular thermal inclusion
Grahic Jump Location
The reduced problem (2.132.142.15) of a homogeneous elastic plane containing the same voids and cracks
Grahic Jump Location
A thermal inclusion of arbitrary shape with internal or nearby voids and cracks

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