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TECHNICAL PAPERS

Factors Affecting the Operational Thermal Resistance of Electronic Components

[+] Author and Article Information
Mark R. D. Davies, Reena Cole

PEI Technologies: Stokes Research Institute, Mechanical and Aeronautical Engineering Department, University of Limerick, Limerick, Ireland

John Lohan

Mechanical and Industrial Engineering Department, Galway-Mayo Institute of Technology, Dublin Road, Galway, Irelande-mail: john.lohan@merlin.gmit.ie

J. Electron. Packag 122(3), 185-191 (Nov 15, 1999) (7 pages) doi:10.1115/1.1286101 History: Received July 26, 1998; Revised November 15, 1999
Copyright © 2000 by ASME
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References

Figures

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Representation of PCB mounted components in forced convection
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Critical component #1 with heat generating components nos. 2–5
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Definition of the control volume for thermal resistance as the component and its thermal footprint on the PCB, defined by the adiabatic edge. (Note: Among other conditions the footprint size will depend upon PCB conductivity.)
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Double Euro-Card multi-component thermal test PCB, all dimensions are in millimeters, L=30 mm
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Test cases: thermal resistance measured from component shown by outline, with powered components shown shaded. In cases 12 and 13 the noncomponent side of the board is insulated. Flow is from left to right.
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Aerodynamic factor, f1, for middle component in center row, powered at 3W (cases 1, 2, and 6 in Fig. 5)
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Aerodynamic factor, case 2, and thermal factor, case 3, for middle component in center row, see Fig. 5. (Components are powered at 3W.)
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Aerodynamic factor, case 6, and thermal factors, cases 12 and 13, for middle component in center row when noncomponent side of board is insulated, see Fig. 5. (Components are powered at 3W.)
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Aerodynamic factor, f1, for each component in center row, cases 4–8 in Fig. 5
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Aerodynamic and thermal factors for middle component in 2nd column (cases 5, 9, and 11 in Fig. 5), with all powered components dissipating 3W
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Aerodynamic and thermal factors for the middle component in 2nd column (cases 5, 10, and 11 in Fig. 5), with components powered nonuniformly as in Fig. 12
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Power dissipation distribution, qr*, for the nonuniform powered case, referenced to center component in the second column, generating 4W

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