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TECHNICAL PAPERS

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

[+] Author and Article Information
Z. Q. Yu, Y. C. Chan, D. P. Webb, G. Y. Li

Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong

J. Electron. Packag 122(2), 172-177 (May 21, 1999) (6 pages) doi:10.1115/1.483151 History: Received May 21, 1999
Copyright © 2000 by ASME
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References

Goldberg,  L., 1995, “Multilayer, Low-fire, Ceramic Substrates Sport Embedded Components, New Packaging Solutions,” Electron. Des., 34, pp. 40–42.
Fu, S. L., L. S. Chen, and Lu, J. N., 1996, “Low Temperature Sinterable Multilayer Glass-Ceramic Substrate,” Microelectron. Int., No. 39, pp. 20–21.
Chen, Lih-Shan, Shen-Li, Fu, and Kwan-Dar, Huang, 1997, “Low Temperature Sinterable Multilayer Ceramic Substrates Embedded With Capacitors,” Proceedings of the Technical Program, Pan Pacific Microelectronics Symposium, Maui, HI, 28–31 Jan., pp. 271–221.
Slattery,  O., Hayes,  T., Lawton,  W., Kelly,  G., Lyden,  C., Barrett,  J., and Mathuna,  C. O’, 1995, “Methods of Analysing Thermomechanical Stress in Plastic Packages for Integrated Circuits,” J. Mater. Process. Technol., 54, pp. 199–204.
Nagalingam, J., Mohd-yusoff, S. D., Ramakrishnan, P., Jaafar, R., and Francis, C., 1997, “Scanning Acoustic Microscope (SAM—A Measurement Tool for Plastic IC Packages,” Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits, pp. 244–249.
Semmens, J. E., and Kessler, L. W., 1997, “Further Investigation into the use of Acoustic Micro Imaging for Analyzing Flip Chip Integrity and Failure Modes,” Proceedings 1997 International Conference on Multichip Modules, pp. 165–169.
Chen,  Y. C., So,  W. W., and Lee,  C. C., 1997, “A Fluxless Bonding Technology Using Indium-Silver Multilayer Composites,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 20, Iss. 1, pp 46–51.
Chan,  Y. C., and Li,  G. Y., 1998, “Fabrication and Characterization of Multilayer Capacitors Buried in Low Temperature Co-Fired Ceramic Substrate,” Active Passive Electron. Compon., 20, pp. 215–224.

Figures

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Schematic diagram of a reflection scanning acoustic microscope, with associated circuitry
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Schematic diagram of the transducer arrangement in a transmission scanning acoustic microscope
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THRU-scan image of a good LTCC substrate with embedded capacitors
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(a) THRU-scan image of a defective buried capacitor with delaminations; (b) transmission signals at point 1; (c) transmission signals at point 2
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(a) THRU-scan image of a defective substrate with buried capacitor after thermal shock; (b) transmission signals at point 1; (c) transmission signals at point 2
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(a) THRU-scan image of another defective substrate with buried capacitor after thermal shock; (b) transmission signals at point 1; (c) transmission signals at point 2
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SEM micrographs of cross-sectional views of the defective capacitors at the position indicated by THRU-scan are shown in Fig. 6
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TAMI-scan images of a good buried capacitor; (a) the first electrode/ceramic interface; (b) the second electrode/ceramic interface; (c) the third electrode/ceramic interface; (d) the fourth electrode/ceramic interface; (e) signature of different interfaces
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TAMI-scan image of a cracked substrate
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TAMI-scan image of the same sample of Fig. 5

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