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TECHNICAL PAPERS

Nondestructive Evaluation of Ceramic Substrate With Embedded Passive Components by SAM

[+] Author and Article Information
Z. Q. Yu, Y. C. Chan, D. P. Webb, G. Y. Li

Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong

J. Electron. Packag 122(2), 172-177 (May 21, 1999) (6 pages) doi:10.1115/1.483151 History: Received May 21, 1999
Copyright © 2000 by ASME
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References

Figures

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Schematic diagram of a reflection scanning acoustic microscope, with associated circuitry
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Schematic diagram of the transducer arrangement in a transmission scanning acoustic microscope
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THRU-scan image of a good LTCC substrate with embedded capacitors
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(a) THRU-scan image of a defective buried capacitor with delaminations; (b) transmission signals at point 1; (c) transmission signals at point 2
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(a) THRU-scan image of a defective substrate with buried capacitor after thermal shock; (b) transmission signals at point 1; (c) transmission signals at point 2
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(a) THRU-scan image of another defective substrate with buried capacitor after thermal shock; (b) transmission signals at point 1; (c) transmission signals at point 2
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SEM micrographs of cross-sectional views of the defective capacitors at the position indicated by THRU-scan are shown in Fig. 6
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TAMI-scan images of a good buried capacitor; (a) the first electrode/ceramic interface; (b) the second electrode/ceramic interface; (c) the third electrode/ceramic interface; (d) the fourth electrode/ceramic interface; (e) signature of different interfaces
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TAMI-scan image of a cracked substrate
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TAMI-scan image of the same sample of Fig. 5

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