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TECHNICAL PAPERS

A Novel High Performance Die Attach for Ceramic Packages

[+] Author and Article Information
J. Z. Shi, X. M. Xie

SIM DaimlerChrysler Lab, Shanghai Institute of Metallurgy, 865 Changning Road, Shanghai 200050, P.R. Chinae-mail: xmxie@itsvr.sim.ac.cn

F. Stubhan, J. Freytag

DaimlerChrysler Research Institute, Goldsteinstrasse 235, D-60528 Frankfurt, Germany

J. Electron. Packag 122(2), 168-171 (Mar 15, 1999) (4 pages) doi:10.1115/1.483150 History: Received March 15, 1999
Copyright © 2000 by ASME
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References

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Schmid-Fetzer, R., 1995, “Fundamentals of bonding by isothermal solidification for high temperature semiconductor application,” Design Fundamentals of High Temperature Composites, Intermetallics and Metal-Ceramics System, R. Y. Lin, Y. A. Chang, R. G. Reddy, and C. T. Liu, eds., The Minerals, Metals and Materials Society.
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Wang, T. B., Shen, Z. Z., Ye, R. Q., Xie, X. M., Stubhan, F., and Freytag, J., 2000, “Die Bonding with Au/In Isothermal Solidification Technique,” accepted for publication in Journal of Electronic Materials.
Wang, T. B., and Xie, X. M., Ye, R. Q., Stubhan, F., and Freytag, J., 1999, “Microstructure Characterization of Die Bonding with Au/In Isothermal Solidification Technique,” Submitted for publication in IEEE Trans. Compon., Hybrids, Manuf. Technol., Part A, Advanced Packaging.
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Figures

Grahic Jump Location
(a) Typical C-SAM image of samples bonded at 200°C (red and bright white represent for non-wetted areas, and dark gray color corresponds to normal area, 100 MHz transducer). (b) Typical C-SAM image of samples bonded at 275°C (red and bright white represent for non-wetted areas, and dark gray color corresponds to normal area, 100 MHz transducer)
Grahic Jump Location
Die shear strength before and after thermal cycle test (bonding temperature 200°C∼300°C, 1750 cycles between −55°C and 125°C)
Grahic Jump Location
(a) C-SAM image for samples bonded at 275°C and before thermal cycling test. (b) C-SAM image for samples bonded at 275°C and after 1750 cycles between −55°C and 125°C
Grahic Jump Location
(a) Cross section picture showing a typical region of the IS bonds made by Au/In (bonding temperature 275°C). (b) Cross section picture showing a typical region of the IS bonds with a big void (bonding temperature 275°C).
Grahic Jump Location
Cross section picture showing a typical region of the IS bonds after 1950 cycles of test between −55°C and 125°C (1000×BF)

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