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TECHNICAL PAPERS

A Novel High Performance Die Attach for Ceramic Packages

[+] Author and Article Information
J. Z. Shi, X. M. Xie

SIM DaimlerChrysler Lab, Shanghai Institute of Metallurgy, 865 Changning Road, Shanghai 200050, P.R. Chinae-mail: xmxie@itsvr.sim.ac.cn

F. Stubhan, J. Freytag

DaimlerChrysler Research Institute, Goldsteinstrasse 235, D-60528 Frankfurt, Germany

J. Electron. Packag 122(2), 168-171 (Mar 15, 1999) (4 pages) doi:10.1115/1.483150 History: Received March 15, 1999
Copyright © 2000 by ASME
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References

Figures

Grahic Jump Location
(a) Typical C-SAM image of samples bonded at 200°C (red and bright white represent for non-wetted areas, and dark gray color corresponds to normal area, 100 MHz transducer). (b) Typical C-SAM image of samples bonded at 275°C (red and bright white represent for non-wetted areas, and dark gray color corresponds to normal area, 100 MHz transducer)
Grahic Jump Location
Die shear strength before and after thermal cycle test (bonding temperature 200°C∼300°C, 1750 cycles between −55°C and 125°C)
Grahic Jump Location
(a) C-SAM image for samples bonded at 275°C and before thermal cycling test. (b) C-SAM image for samples bonded at 275°C and after 1750 cycles between −55°C and 125°C
Grahic Jump Location
(a) Cross section picture showing a typical region of the IS bonds made by Au/In (bonding temperature 275°C). (b) Cross section picture showing a typical region of the IS bonds with a big void (bonding temperature 275°C).
Grahic Jump Location
Cross section picture showing a typical region of the IS bonds after 1950 cycles of test between −55°C and 125°C (1000×BF)

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