Flow Analysis in a Chip Cavity During Semiconductor Encapsulation

[+] Author and Article Information
S. Han, K. K. Wang

Sibley School of Mechanical and Aerospace Engineering, Cornell University, B60 Rhodes Hall, Ithaca, New York 14853

J. Electron. Packag 122(2), 160-167 (Jan 11, 1999) (8 pages) doi:10.1115/1.483149 History: Received November 05, 1997; Revised January 11, 1999
Copyright © 2000 by ASME
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Manzione, L. T., 1990, Plastic Packaging of Microelectronic Devices, Van Nostrand Reinhold, New York.
Turng,  L. S., and Wang,  V. W., 1993, “On the Simulation of Microelectronic Encapsulation with Epoxy Molding Compound,” J. Reinforced Plastics Composites, 12, pp. 506–519.
Nguyen, 1994, “Flow Simulation in IC Chip Encapsulation,” Electronic Component and Technology Conference, Buena Vista, FL.
Bird, R. B., Armstrong, R. C., and Hassager, O., 1987, Dynamics of Polymeric Liquids, Vol. 1, Wiley-Interscience, New York.
Hieber,  C. A., and Shen,  S. F., 1980, “A Finite-Element/Finite-Difference Simulation of the Injection-Molding Filling Process,” J. Non-Newtonian Fluid Mech., 7, pp. 1–32.
Chiang,  H. H., Hieber,  C. A., and Wang,  K. K., 1991, “A Unified Simulation of the Filling and Postfilling Stages in Injection Molding,” Polym. Eng. Sci., 31, pp. 116–139.
Tucker, C. L., 1987, Injection and Compression Molding Fundamentals, A. I. Isayev, ed., Chap. 7, Marcel Dekker, New York.
Gupta,  M., 1995, “Juncture Loss in an Entrance Region for Polymeric Materials,” SPE Tech. Pap., Vol. 1, pp. 774–778.
Gibson, A. G., 1988, Rheological Measurement, A. A. Collyer, and D. W. Clegg, eds., Chap. 3, Elsevier Applied Science, New York.
Han,  S., Wang,  K. K., Hieber,  C. A., and Cohen,  C., 1997, “Characterization of the Rheological Properties of a Fast-Curing Epoxy Molding Compound,” J. Rheol., 42, pp. 177–195.
Castro,  J. M., and Macosko,  C. W., 1980, “Kinetics and Rheology of Typical Polyurethane Reaction Injection Molding Systems,” SPE Tech. Pap., 26, pp. 434–438.
Karnal, M. R., and Ryan, M. E., 1987, Injection and Compression Molding Fundamentals, A. I. Isayev, ed., Chap. 4, Marcel Dekker, New York.


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Calculation of b0 and b1 for the leadframe
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Finite-element mesh used in the calculation for the silicone-oil case
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(a) Distance between melt fronts at cavity 1 and cavity 2 for silicone oil and (b) pressure at two nodal points in the entrance region (P1: Node at cavity 1; P2: node at cavity 2). Cross-flow rate from cavity 1 to cavity 2 for silicone oil.
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(a) Schematic diagram of flow in a thin cavity. Ce refers to entrance into cavity, Cm to the advancing melt front, Ci to possible inserts in the mold, and Co to the outer boundary of cavity and (b) coordinate in the thickness direction. The cavity is thin in the z-direction with a gap thickness of 2h. Here z=0 corresponds to the mold wall and z=2h corresponds to the leadframe.
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A geometry for the flow through a leadframe opening (2b1 corresponds to leadframe opening size)
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Extra pressure drop coefficient (KX) versus Z(z/b1) In the developing-flow region of a parallel plate for a power-law fluid with n=0.74
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(a) Experimental setup used for the visualization of flow in a cavity with leadframe and (b) leadframe used in the experiment
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Side-view of a rectangular cavity with a leadframe in the middle. Fluid is fed at cavity 1 and some fluid flow through leadframe to cavity 2.
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Measured and calculated distance between two melt-fronts at cavity 1 and 2 for silicone oil
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Viscosity versus shear rate of silicone oil (Dow-Corning 200) at 22°C used in the experiment
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(a) Openings in the leadframe for the leadframe used in this experiment, and (b) one example of cavity modeling with some of the cross-flow elements
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Modeling of thickness in the chip cavity (arrows represent the cavity thickness to be used in the simulation at each region)
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Finite-element mesh used for the simulation in the epoxy-molding compound case
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Melt-front shapes obtained from experiment (a) and from simulation (b) after 2.0 seconds of filling
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Melt-front shapes obtained from experiment (a) and from simulation (b) after 2.8 seconds of filling




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