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TECHNICAL PAPERS

Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater Array

[+] Author and Article Information
Wataru Nakayama

CALCE Electronic Packaging Research Center, University of Maryland, College Park, MD 20742

Masud Behnia

School of Mechanical and Manufacturing Engineering, University of New South Wales, Sydney, NSW 2052, Australiam.behnia@unsw.edu.au

Hiroaki Mishima

Department of Mechanical and Intelligent Systems Engineering, Tokyo Institute of Technology, Oh-okayama, Meguro, Tokyo, Japan

J. Electron. Packag 122(2), 132-137 (Feb 18, 2000) (6 pages) doi:10.1115/1.483145 History: Received November 11, 1998; Revised February 18, 2000
Copyright © 2000 by ASME
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References

Nakayama, W., 1997, “Liquid Cooling of Electronic Equipment: Where Does it Offer Variable Solutions?” Advances in Electronic Packaging, Vol. 2, E. Suhir, Y. C. Lee, M. Shiratori, and G. Subbarayan, eds., ASME, New York, pp. 2045–2052.
Johns,  M. E., and Mudawar,  I., 1996, “An Ultra-High Power Two-Phase Jet-Impingement Avionic Clamshell Module,” ASME J. Electron. Packag., 118, No. 4, pp. 264–270.
Nakayama,  W., 1990, “On the Accommodation of Coolant Flow Paths in High Density Packaging,” IEEE Trans. Compon., Hybrids, Manuf. Technol., CHMT-13, No. 4, pp. 1040–1049.
Heindel,  T. J., Ramadhyani,  S., and Incropera,  F. P., 1992, “Liquid Immersion Cooling of a Longitudinal Array of Discrete Heat Sources in Protruding Substrates: II—Forced Convection Boiling,” ASME J. Electron. Packag., 114, pp. 63–70.
Lin,  Z. H., Chou,  Y. J., and Hung,  Y. H., 1997, “Heat Transfer Behaviors of a Confined Slot Jet Impingement,” Int. J. Heat Mass Transf., 40, No. 5, pp. 1095–1107.
Maddox, D. E., and Bar-Cohen, A., 1991, “Thermofluid Design of Submerged-Jet Impingement Cooling for Electronic Components,” Heat Transfer in Electronic Equipment, ASME HTD-171, pp. 71–80.
Mudawar,  I., and Wadsworth,  D. C., 1991, “Critical Heat Flux From a Simulated Chip to a Confined Rectangular Impinging Jet of Dielectric Liquid,” Int. J. Heat Mass Transf., 34, No. 6, pp. 1465–1479.
Nakayama,  W., Behnia,  M., Mishima,  H., and Sun,  H., 1996, “Heat Transfer From an Array of Strips to Fluorinert Coolant in a Mixed Impinging-Jet/Channel-Flow Configuration,” ASME J. Electron. Packag., 118, No. 1, pp. 31–36.
Wadsworth,  D. C., and Mudawar,  I., 1990, “Cooling of a Multichip Electronic Module by Means of Confined Two-Dimensional Jets of Dielectric Liquid,” ASME J. Heat Transfer, 112, pp. 891–898.
Ma,  C. F., and Bergles,  A. E., 1983, “Jet Impingement in Nucleate Boiling,” Int. J. Heat Mass Transf., 29, No. 8, pp. 1095–1101.
Sun,  H., Ma,  C.-F., and Nakayama,  W., 1993, “Local Characteristics of Convective Heat Transfer from Simulated Microelectronic Chips to Impinging Submerged Round Water Jets,” ASME J. Electron. Packag., 115, No. 1, pp. 71–77.
Jaeger,  R. C., Goodling,  J. S., Baginski,  M. E., Ellis,  C. D., Williamson,  N. V., and O’Barr,  R. M., 1989, “High Heat Flux Cooling for Silicon Hybrid Multichip Packaging,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 12, No. 4, pp. 772–779.
Schafer,  D., Incropera,  F. P., and Ramadhyani,  S., 1991, “Planar Liquid Jet Impingement Cooling of Multiple Discrete Heat Sources,” ASME J. Electron. Packag., 113, No. 4, pp. 359–366.
Lee, T. Y., Simon, T. W., and Bar-Cohen, A., 1988, “An Investigation of Short-Heating Length Effects on Flow Boiling Critical Heat Flux in a Subcooled Turbulent Flow,” Cooling Technology for Electronic Equipment, W. Aung, ed., Hemisphere Publishing Corporation, pp. 435–450.
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Figures

Grahic Jump Location
Experimental apparatus: (a) coolant flow paths; (b) array of foil heaters; the impinging jet is centered on strip No. 3; and (c) cross-section of the test section.
Grahic Jump Location
Boiling curves obtained with 20 K subcooling on the center (No. 3) strip: (a) Uj=1.06 m/s; (b) Uj=3.16 m/s; and (c) Uj=5.28 m/s.
Grahic Jump Location
Boiling curves and CHF’s obtained with 3.2 m/s jet velocity and different subcooling on the center (No. 3) strip
Grahic Jump Location
Heat flux versus temperature difference between the foil and the jet at 3.2 m/s jet velocity on the center (No. 3) strip
Grahic Jump Location
Heat transfer from different strips with 20 K subcooling: (a) Uj=1.06 m/s; (b) Uj=3.18 m/s; and (c) Uj=5.30 m/s.

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