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TECHNICAL PAPERS

Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance

[+] Author and Article Information
Yunsheng Xu, Xiangcheng Luo, D. D. L. Chung

Composite Materials Research Laboratory, State University of New York at Buffalo, Buffalo, NY 14260-4400

J. Electron. Packag 122(2), 128-131 (Dec 28, 1999) (4 pages) doi:10.1115/1.483144 History: Received July 27, 1999; Revised December 28, 1999
Copyright © 2000 by ASME
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References

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Sasaski, T., Hisano, K., Sakamoto, T., Monma, S., Fijimori, Y., Iwasaki, H., and Ishizuka, M., 1995, Japan IEMT Symp. Proc., IEEE/CPMT Int. Electronic Manufacturing Technology (IEMT) Symp., IEEE, Piscataway, NJ, pp. 236–239.

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Grahic Jump Location
Experimental set-up for thermal contact conductance testing

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