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TECHNICAL PAPERS

Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

[+] Author and Article Information
Manjula N. Variyam, Weidong Xie, Suresh K. Sitaraman

The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Electron. Packag 122(2), 121-127 (Nov 29, 1999) (7 pages) doi:10.1115/1.483143 History: Received November 29, 1999
Copyright © 2000 by ASME
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References

Figures

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Schematic of a bilayered structure
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Schematic of the bending of the bilayered structure
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Bending moments and forces in the bilayered structure
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Coordinates and geometry of a laminate
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Axial, shear, and peel stresses in bilayered structure upon heating
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Comparison of warpage among different FEM models
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Warpage from beam-theory analytical formulation
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Comparison of peel stresses among different FEM models and CLT-ESS model
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Comparison of shear stresses among different FEM models and CLT-ESS model
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Comparison of axial stresses (σxx) in material 1 among different FEM models and CLT-ESS model
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Comparison of out-of-plane stresses (σzz) in material 1 among different FEM models
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Comparison of Von Mises stresses in material 1 among different FEM models

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