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TECHNICAL PAPERS

Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

[+] Author and Article Information
Manjula N. Variyam, Weidong Xie, Suresh K. Sitaraman

The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Electron. Packag 122(2), 121-127 (Nov 29, 1999) (7 pages) doi:10.1115/1.483143 History: Received November 29, 1999
Copyright © 2000 by ASME
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References

Suhir,  E., 1986, “Stresses in Bi-Metal Thermostats” ASME J. Appl. Mech., 53, pp. 657–660.
Yi-Hsin,  Pao, and Eisele,  Ellen, 1991, “Interfacial Shear and Peel Stresses in Multi-Layered Thin Stacks subjected to Uniform Thermal Loading,” ASME J. Electron. Packag., 113, pp. 164–172.
Yin, W. L., 1993, “Thermal Stresses in Anisotropic Multilayered Structures,” Thermal Stress and Strain in Microelectronics Packaging, J. H. Lau, ed., Van Nostrand Reinhold, New York, pp. 95–137.
Pan,  T. Y., and Pao,  Y. H., 1990, “Deformation in Mutlilayer Stacked Assemblies,” ASME J. Appl. Mech., 112, pp. 30–34.
Matthys,  L., and De May,  G., 1996, “An Analysis of an Engineering Model for the Thermal Mismatch Stresses at the Interface of a Uniformly Heated Two Layer Structure,” Int. J. Microelectron. Packag., 19, No. 3, pp. 323–329.
Hu,  Shoufeng, and Pagano,  N. J., 1997, “On the use of a Plane-Strain Model to Solve Generalized Plane-Strain Problems,” ASME J. Appl. Mech., 64, pp. 236–238.
Pagano, N. J., 1989, Interlaminar Response of Composite Materials, Elsevier Science Publishers B.V., Amsterdam.
Robbins,  D. H., and Reddy,  J. N., 1996, “Variable Kinematic Modelling of Laminated Composite Plates,” Int. J. Numer. Methods Eng., 39, pp. 2283–2317.
Chandrashekhara, S., and Santhosh, N., 1987, “Free Edge Stress Analysis of Laminates by a Mixed Method of Elasticity,” Proceedings of the American Society for Composites, pp. 479–488.
Bhat,  N. V., and Lagace,  P. A., 1994, “An Analytical Method for Evaluation of Interlaminal Stresses Due to Material Discontinuities,” J. Comp. Mat., 28, No. 3, pp. 190–210.
Tsai,  M. Y., and Morton,  J., 1994, “A Note on Peel Stresses in Single-Lap Adhesive Joints,” ASME J. Appl. Mech., 61, pp. 712–715.
Burgreen, David, 1971, Elements of Thermal Stress Analysis, C. P. Press, Jamaica, New York.
Xie, Weidong, and Sitaraman, Suresh K., 1999, “Analysis of Interlaminar Thermal Stresses in Unsymmetric Multi-Layered electronic Assemblies and Packages,” EEP-Vol. 26-2, Advances in Electronic Packaging-1999, Vol. 2, ASME, pp. 1155–1163.
Suhir, E., 1986, “Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies,” Proceedings of the 1986 International Symposium on Microelectronics, Atlanta, GA, ISHM, pp. 383–392.
Mirman,  Ilya B., 1991, “Effects of Peeling Stresses in Bimaterial Assembly,” ASME J. Electron. Packag., 113, pp. 431–433.
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Figures

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Bending moments and forces in the bilayered structure
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Schematic of the bending of the bilayered structure
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Schematic of a bilayered structure
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Comparison of Von Mises stresses in material 1 among different FEM models
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Comparison of out-of-plane stresses (σzz) in material 1 among different FEM models
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Comparison of axial stresses (σxx) in material 1 among different FEM models and CLT-ESS model
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Comparison of shear stresses among different FEM models and CLT-ESS model
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Comparison of peel stresses among different FEM models and CLT-ESS model
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Warpage from beam-theory analytical formulation
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Comparison of warpage among different FEM models
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Axial, shear, and peel stresses in bilayered structure upon heating
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Coordinates and geometry of a laminate

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