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TECHNICAL PAPERS

Thermal Placement Design for MCM Applications

[+] Author and Article Information
Yu-Jung Huang, Shen-Li Fu

Department of Electronic Engineering, I-Shou University, Kaohsiung, Taiwan, 84008 R.O.C.

J. Electron. Packag 122(2), 115-120 (Nov 09, 1999) (6 pages) doi:10.1115/1.483142 History: Received November 09, 1999
Copyright © 2000 by ASME
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References

Figures

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Z function for repulsive force calculation
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The comparison between Z functions with different cross points m 1 and m 2
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S function used to calculate the attractive force
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The pseudocode of the proposed algorithm
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Design flow diagram for the thermal placement algorithm
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Thermal placement analysis results for 7 chips with the block overlap phenomena
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The final results after resolving the block overlap conflict in Fig. 6
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The placement results of a five-chip MCM based on our thermal force-directed algorithm
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The thermal distribution based on the quadrisection placement method
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The thermal distribution using thermal placement method developed in this work

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