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TECHNICAL PAPERS

Thermal Placement Design for MCM Applications

[+] Author and Article Information
Yu-Jung Huang, Shen-Li Fu

Department of Electronic Engineering, I-Shou University, Kaohsiung, Taiwan, 84008 R.O.C.

J. Electron. Packag 122(2), 115-120 (Nov 09, 1999) (6 pages) doi:10.1115/1.483142 History: Received November 09, 1999
Copyright © 2000 by ASME
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References

Bar-Cohen,  V., 1987, “Thermal Management of Air- and Liquid-Cooled Multichip Modules,” IEEE Trans. Compon., Hybrids, Manuf. Technol., CHMT-10, No. 2, pp. 159–175.
Schaper,  L. W., 1992, “Design of Multichip Modules,” Proc. IEEE, 80, No. 12, pp. 1955–1964.
Bar-Cohen, A., and Kraus, A. D., 1993, Advances in Thermal Modeling of Electronic Components and Systems, Vol. 3, ASME Press, New York/IEEE Press, New York.
Queipo,  N. V., Humphrey,  A. C., and Ortega,  A., 1998, “Multiobjective Optimal Placement of Convectively Cooled Electronic Components on Printed Wiring Boards,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 21, No. 1, pp. 142–153.
Sherwani, N. A., 1993, Algorithms for VLSI Physical Design Automation, Kluwer Academic Publishers, Boston, MA, Chap. 5.
Lee,  J., and Chou,  J. H., 1996, “Hierarchical Placement for Power Hybrid Circuits Under Reliability and Wireability Constraints,” IEEE Trans. Reliab., 45, No. 2, pp. 200–207.
Lee,  J., Chou,  J. H., and Fu,  S. L., 1995, “Reliability and Wireability Optimizations for Module Placement on Convectively Cooled Printed Wiring Board,” Integration, the VLSI J., 18, No. 3, pp. 173–186.
Osterman,  M. D., and Pecht,  M., 1990, “Placement for Reliability and Routability of Convectively Cooled PWB’s,” IEEE Trans. Comput.-Aided Des., 9, No. 7, pp. 734–744.
Quinn,  N. R., and Breuer,  M. A., 1979, “A Forced Directed Component Placement Procedure for Printed Circuit Boards,” IEEE Trans. Circuits Syst., CAS-26, No. 6, pp. 377–388.
Zadeh, L. A., Fu, K. S., Tanaka, K., and Shimura, M., 1975, Fuzzy Sets and Their Applications to Cognitive and Decision Processes, Academic, London.
Doane, D. A., and Franzon, P. D., 1993, Mutichip Module Technologies and Alternatives The Basics, Chapter 12, Van Nostrand Reinhold, New York.
Hanan, M., and Kurtzberg, J., 1972, “Placement Technique,” Design Automation of Digital Systems: Theory and Techniques, Breuer, M. A., ed., Prentice-Hall, Englewood Cliffs, NJ, Chap. 5.
Burnett, D. S., 1987, Finite Element Analysis, Addision-Wesley.

Figures

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Z function for repulsive force calculation
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The comparison between Z functions with different cross points m 1 and m 2
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S function used to calculate the attractive force
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The pseudocode of the proposed algorithm
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Design flow diagram for the thermal placement algorithm
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Thermal placement analysis results for 7 chips with the block overlap phenomena
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The final results after resolving the block overlap conflict in Fig. 6
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The placement results of a five-chip MCM based on our thermal force-directed algorithm
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The thermal distribution based on the quadrisection placement method
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The thermal distribution using thermal placement method developed in this work

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