Thermal Management Strategies for Embedded Electronic Components of Wearable Computers

[+] Author and Article Information
Eric Egan, Cristina H. Amon

Department of Mechanical Engineering, Institute for Complex Engineered Systems, Carnegie Mellon University, 5000 Forbes Avenue, Pittsburgh, PA 15213

J. Electron. Packag 122(2), 98-106 (Sep 15, 1999) (9 pages) doi:10.1115/1.483140 History: Received June 02, 1999; Revised September 15, 1999
Copyright © 2000 by ASME
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VuMan3R wearable computer with embedded electronics: (a) photograph with heads-up display, (b) solid model
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Embedded electronic artifact: (a) side view, (b) plane view
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FEM conduction-only model showing 1/4 cross section of embedded electronic artifact
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Designation of effective heat transfer coefficients for heat spreader
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Transient temperature rise of embedded component for empty cavity and bimaterial models with kinner=2.0;kouter=0.25 W/m K
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Thermal resistance network of bimaterial embedded electronic artifact
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Temperature profile of VuMan3R indicating the location of the processor, PLD, Eprom, and SRAM components




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