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TECHNICAL PAPERS

Thermal Management Strategies for Embedded Electronic Components of Wearable Computers

[+] Author and Article Information
Eric Egan, Cristina H. Amon

Department of Mechanical Engineering, Institute for Complex Engineered Systems, Carnegie Mellon University, 5000 Forbes Avenue, Pittsburgh, PA 15213

J. Electron. Packag 122(2), 98-106 (Sep 15, 1999) (9 pages) doi:10.1115/1.483140 History: Received June 02, 1999; Revised September 15, 1999
Copyright © 2000 by ASME
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References

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Siewiorek,  D. P., Smailagic,  A., Lee,  J., and Tabatabai,  A. R. A., 1994, “An Interdisciplinary Concurrent Design Methodology as Applied to the Navigator Wearable Computer System,” J. Comput. Software Eng., 2, No. 3, pp. 259–292.
Amon,  C. H., Nigen,  J. S., Siewiorek,  D. P., Smailagic,  A., and Stivoric,  J. M., 1995, “Concurrent Design and Analysis of the Navigator Wearable Computer System: The Thermal Perspective,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 18, No. 3, pp. 567–577.
Amon,  C. H., Egan,  E., Siewiorek,  D., and Smailagic,  A., 1997, “Thermal Management and Concurrent System Design of a Wearable Multicomputer,” IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 20, No. 2, pp. 128–137.
Amon, C., Beuth, J., Kirchner, H., Merz, R., Prinz, F., Schmaltz, K., and Weiss, L., 1993, “Material Issues in Layered Forming,” Proc. Solid Freeform Fabrication Symp., H. L. Marcus et al., eds., Austin, TX, pp. 1–10.
Amon,  C. H., Beuth,  J. L., Weiss,  L. E., Merz,  R., and Prinz,  F. B., 1998, “Shape Deposition Manufacturing With Microcasting: Processing, Thermal, and Mechanical Issues,” ASME J. Manuf. Sci. Eng., 120, pp. 656–668.
Bigg,  D. M., 1986, “Thermally Conductive Polymer Compositions,” Polym. Compos., 7, pp. 125–126.
Egan, E., and Amon, C. H., 1996, “Cooling Strategies for Embedded Electronic Components of Wearable Computers Fabricated by Shape Deposition Manufacturing,” I-Therm ’96, IEEE InterSociety Conference on Thermal Phenomena, Orlando, FL, pp. 13–20.
Egan, E. R., and Amon, C. H., 1997, “A Study on the Thermal Conductivity Enhancement of Several Polymer Composites for Embedded Electronics Applications,” ASME-HTD Proc. of the 32nd National Heat Transfer Conference, 6 , pp. 103–109.
Ahmed,  I., Krane,  R. J., and Parsons,  J. R., 1994, “A Preliminary Investigation of the Cooling of Electronic Components with Flat Plate Heat Sinks,” ASME J. Electron. Packag., 116, No. 1, pp. 60–67.
Ellison, G. N., 1984, Thermal Computations for Electronic Equipment, Van Nostrand Reinhold Company Inc., New York, pp. 75–93.
Incropera, F. P., and De Witt, D. P., 1990, Fundamentals of Heat and Mass Transfer, 3rd ed., John Wiley & Sons, Inc., New York, pp. 533–559 and pp. 794–806.
Egan, E., and Amon, C. H., 1995, “Thermal Design of Wearable Computers: Application to the Navigator2, Thermal Management Devices, and Embedded Electronics,” EDRC Report No. 24-123-95, Carnegie Mellon University, Pittsburgh, PA.

Figures

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VuMan3R wearable computer with embedded electronics: (a) photograph with heads-up display, (b) solid model
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Embedded electronic artifact: (a) side view, (b) plane view
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FEM conduction-only model showing 1/4 cross section of embedded electronic artifact
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Designation of effective heat transfer coefficients for heat spreader
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Transient temperature rise of embedded component for empty cavity and bimaterial models with kinner=2.0;kouter=0.25 W/m K
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Thermal resistance network of bimaterial embedded electronic artifact
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Temperature profile of VuMan3R indicating the location of the processor, PLD, Eprom, and SRAM components

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