Thermal Management Strategies for Embedded Electronic Components of Wearable Computers

[+] Author and Article Information
Eric Egan, Cristina H. Amon

Department of Mechanical Engineering, Institute for Complex Engineered Systems, Carnegie Mellon University, 5000 Forbes Avenue, Pittsburgh, PA 15213

J. Electron. Packag 122(2), 98-106 (Sep 15, 1999) (9 pages) doi:10.1115/1.483140 History: Received June 02, 1999; Revised September 15, 1999
Copyright © 2000 by ASME
Your Session has timed out. Please sign back in to continue.



Grahic Jump Location
VuMan3R wearable computer with embedded electronics: (a) photograph with heads-up display, (b) solid model
Grahic Jump Location
Embedded electronic artifact: (a) side view, (b) plane view
Grahic Jump Location
FEM conduction-only model showing 1/4 cross section of embedded electronic artifact
Grahic Jump Location
Designation of effective heat transfer coefficients for heat spreader
Grahic Jump Location
Transient temperature rise of embedded component for empty cavity and bimaterial models with kinner=2.0;kouter=0.25 W/m K
Grahic Jump Location
Thermal resistance network of bimaterial embedded electronic artifact
Grahic Jump Location
Temperature profile of VuMan3R indicating the location of the processor, PLD, Eprom, and SRAM components




Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In