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TECHNICAL PAPERS

A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging

[+] Author and Article Information
Anh X. H. Dang, I. Charles Ume

School of Mechanical Engineering, Georgia Institute of Technology, 813 Ferst Drive, Atlanta, GA 30332

Swapan K. Bhattacharya

Packaging Research Center, Georgia Institute of Technology, 813 Ferst Drive, Atlanta, GA 30332

J. Electron. Packag 122(2), 86-91 (Dec 29, 1999) (6 pages) doi:10.1115/1.483152 History: Received June 01, 1999; Revised December 29, 1999
Copyright © 2000 by ASME
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References

Figures

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Schematic of shadow Moiré setup
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Simulated infrared reflow on-line measurement system
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AFM images of the dielectric coated SS surface topology
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AFM images of the dielectric coated SS surface roughness
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Cracking of parylene film, 50X
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Filled 0.01 inch diameter vias
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Cross-section of filled via
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Three-dimensional warpage data plot and discrete data locations
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SS Sample 1, as received, at room temperature: (a) Moiré phased image; (b) point values; (c) three-dimensional surface plot
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SS Sample 1, post parylene coating, at room temperature: (a) Moiré phased image; (b) point values; (c) three-dimensional surface plot
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SS Sample 1, post via-fill, at room temperature: (a) Moiré phased image; (b) point values; (c) three-dimensional surface plot

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