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TECHNICAL PAPERS

Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages

[+] Author and Article Information
Dickson T. S. Yeung, David C. C. Lam, Matthew M. F. Yuen

Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong

J. Electron. Packag 122(1), 67-72 (Dec 09, 1999) (6 pages) doi:10.1115/1.483137 History: Received October 28, 1999; Revised December 09, 1999
Copyright © 2000 by ASME
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References

Figures

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Various test specimens for measuring interfacial fracture resistance: (a) brazil-nut-sandwich; (b) symmetric double cantilever beam; (c) asymmetric double cantilever beam; (d) end-notched flexure; and (e) center cracked beam (CCB).
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Interfacial crack tip region
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Half model of a four-layer CCB specimen
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Equivalent model (formulation by superposition)
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GSS as a function of h1 and h1/h3
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GSS as a function of h2 and h2/h3
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GSS as a function of h3 and h2/h3
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(a) GSS as a function of thickness ratio; (b) |GSS| as a function of thickness ratio
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GSS as a function of E3 and E2/E3
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(a) GSS as a function of modulus ratio; (b) |GSS| as a function of modulus ratio

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