Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages

[+] Author and Article Information
Dickson T. S. Yeung, David C. C. Lam, Matthew M. F. Yuen

Department of Mechanical Engineering, Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong

J. Electron. Packag 122(1), 67-72 (Dec 09, 1999) (6 pages) doi:10.1115/1.483137 History: Received October 28, 1999; Revised December 09, 1999
Copyright © 2000 by ASME
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Grahic Jump Location
Various test specimens for measuring interfacial fracture resistance: (a) brazil-nut-sandwich; (b) symmetric double cantilever beam; (c) asymmetric double cantilever beam; (d) end-notched flexure; and (e) center cracked beam (CCB).
Grahic Jump Location
Interfacial crack tip region
Grahic Jump Location
Half model of a four-layer CCB specimen
Grahic Jump Location
Equivalent model (formulation by superposition)
Grahic Jump Location
GSS as a function of h1 and h1/h3
Grahic Jump Location
GSS as a function of h2 and h2/h3
Grahic Jump Location
GSS as a function of h3 and h2/h3
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(a) GSS as a function of thickness ratio; (b) |GSS| as a function of thickness ratio
Grahic Jump Location
GSS as a function of E3 and E2/E3
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(a) GSS as a function of modulus ratio; (b) |GSS| as a function of modulus ratio




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