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TECHNICAL PAPERS

Interfacial Thermal Stress Analysis of Anisotropic Multi-Layered Electronic Packaging Structures

[+] Author and Article Information
Weidong Xie, Suresh K. Sitaraman

Computer-Aided Simulation of Packaging Reliability (CASPaR) Laboratory, The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332-0405

J. Electron. Packag 122(1), 61-66 (Dec 12, 1999) (6 pages) doi:10.1115/1.483133 History: Received November 08, 1999; Revised December 12, 1999
Copyright © 2000 by ASME
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References

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Figures

Grahic Jump Location
Coordinates and geometry of a laminate
Grahic Jump Location
(a) Normalized axial stress, σ22/(E1α1|ΔT|) versus nondimensional distance, x2/h from the free edge on the interface between the substrate and adhesive layer; (b) normalized axial stress, σ22/(E1α1|ΔT|) versus nondimensional distance, x2/h from the free edge on the interface between the die and adhesive layer.
Grahic Jump Location
(a) Normalized shear stress, σ23/(E1α1|ΔT|) versus nondimensional distance, x2/h from the free edge on the interface between the substrate and adhesive layer; (b) Normalized shear stress, σ23/(E1α1|ΔT|) versus nondimensional distance, x2/h from the free edge on the interface between the die and adhesive layer.
Grahic Jump Location
(a) Normalized peel stress, σ33/(E1α1|ΔT|) versus nondimensional distance, x2/h from the free edge on the interface between substrate and adhesive layer; (b) Normalized peel stress, σ33/(E1α1|ΔT|) versus nondimensional distance, x2/h from the free edge on the interface between die and adhesive layer.

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