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TECHNICAL PAPERS

Thermomechanical Fatigue Testing and Analysis of Solder Alloys

[+] Author and Article Information
M. A. Palmer, P. E. Redmond, R. W. Messler

Center for Integrated Electronics and Electronics Manufacturing, Rensselaer Polytechnic Institute, Troy, NY 12180

J. Electron. Packag 122(1), 48-54 (Sep 03, 1999) (7 pages) doi:10.1115/1.483131 History: Received June 30, 1999; Revised September 03, 1999
Copyright © 2000 by ASME
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References

Figures

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Load frame used for TMF evaluation
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Typical thermal cycle: temperatures in 1 min increments
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Sample data. The arrow indicates the time evolution of the hysteresis loop.
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Stress strain data for Sn–Bi in compliant frame, 85 cycles
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Stress strain data for Sn–Pb in compliant frame, 85 cycles
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Energy absorbed per cycle for Sn–Bi in compliant frame
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Energy absorbed per cycle for Sn–Pb in compliant frame
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Cumulative energy distribution for Sn–Bi
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Cumulative energy distribution for Sn–Pb
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Stress strain data for Sn–Bi in stiff frame, 50 cycles
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Stress-strain data for Sn–Ag in stiff frame, 100 cycles
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Cycle by cycle data for Sn–Bi
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Cycle by cycle data for Sn–Ag
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Cumulative energy in Sn–Bi
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Cumulative energy in Sn–Ag
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Anomalous hysteresis loop

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