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TECHNICAL PAPERS

Over-Temperature Forecasts on Electronic Packages Through a Transient R–C Model

[+] Author and Article Information
Ben-Je Lwo

Department of Mechanical Engineering, Chung Cheng Institute of Technology, Tashi, Taoyuan, Taiwan, 335, R. O. C.e-mail: lwob@ccit.edu.tw

Kun-Fu Tseng, Luke Su Lu

Department of Electrical Engineering, Chung Cheng Institute of Technology, Tashi, Taoyuan, Taiwan, 335, R. O. C.

Ching-Hsing Kao

Department of Applied Physics, Chung Cheng Institute of Technology, Tashi, Taoyuan, Taiwan, 335, R. O. C.

J. Electron. Packag 122(1), 42-47 (Aug 13, 1999) (6 pages) doi:10.1115/1.483130 History: Received June 14, 1999; Revised August 13, 1999
Copyright © 2000 by ASME
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References

Figures

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(a) The input power pulse; (b) the corresponding time-temperature response from (a)
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The power pulse stages where t0=13.6 s,t1=18.6 s,t2=23.6 s,t3=28.6 s, and t4=33.6 s. There are a total of ten stages.
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The predicted steady-state temperature by the stage method under free air convection
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The predicted steady-state temperature by the stage method under forced air convection
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The predicted steady-state temperature by the stage method under oil bath convection
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Temperature response at different powers under free air convection
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Calculated steady-state temperatures by OSD method in free air convection
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Calculated steady-state temperatures by TSD method in free air convection
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Calculated steady-state temperatures by TSD method in bathed oil
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Calculated steady-state temperatures by TSD method in forced air convection
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Calculated steady-state resistance with different RC for 1 W power under free air convection
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Measured and calculated steady-state resistance for normal and abnormal power conditions
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The calibrated resistance-temperature (R–T) relations of polysilicon sensors on a test chip

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