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TECHNICAL PAPERS

Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method

[+] Author and Article Information
John H. Lau, S. W. Ricky Lee

Express Packaging Systems, Inc., 1137-B San Antonio Road, Palo Alto, CA 94303

J. Electron. Packag 122(1), 34-41 (Aug 31, 1999) (8 pages) doi:10.1115/1.483129 History: Received January 06, 1999; Revised August 31, 1999
Copyright © 2000 by ASME
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References

Figures

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Schematic diagrams of the PBGA package with two different crack paths
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Young’s modulus of the die attach
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Shear strength of the die attach
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Temperature profile during solder reflow
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Maximum shear stress distribution in the die attach at various temperatures
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The “popcorn” pressure as a function of temperature
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Schematic diagram for the crack tip opening displacement (CTOD)
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Schematic diagram for the virtual crack closure technique (VCCT)
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Strain energy release rate for different crack lengths and temperatures by the VCCT and CTOD methods (crack in the die attach)
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Stress intensity factor and phase angle for different crack lengths and discrete temperatures by CTOD method (crack in the die attach)
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Stress intensity factors for different crack lengths and continuous temperatures
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Strain energy release rate with a/L=0.1 (crack in the die attach) by VCCT and CTOD methods
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Strain energy release rate with a/L=0.3 (crack in the die attach) by VCCT and CTOD methods
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Strain energy release rate with a/L=0.5 (crack in the die attach) by VCCT and CTOD methods
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Strain energy release rate with a/L=0.7 (crack in the die attach) by VCCT and CTOD methods
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Stress intensity factors and phase angle with a/L=0.1 (crack in the die attach) by CTOD method
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Strain energy release rate with a/L=0.7 (crack at the interface between the solder mask and copper) by VCCT and CTOD methods
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Stress intensity factors and phase angle with a/L=0.1 (crack at the interface between the solder mask and copper) by CTOD method
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Stress intensity factors and phase angle with a/L=0.3 (crack at the interface between the solder mask and copper) by CTOD method
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Stress intensity factors and phase angle with a/L=0.5 (crack at the interface between the solder mask and copper) by CTOD method
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Stress intensity factors and phase angle with a/L=0.7 (crack at the interface between the solder mask and copper) by CTOD method
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Stress intensity factors and phase angle with a/L=0.3 (crack in the die attach) by CTOD method
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Stress intensity factors and phase angle with a/L=0.5 (crack in the die attach) by CTOD method
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Stress intensity factors and phase angle with a/L=0.7 (crack in the die attach) by CTOD method
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Strain energy release rate at a/L=0.1 (crack at the interface between the solder mask and copper) by VCCT and CTOD methods
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Strain energy release rate with a/L=0.3 (crack at the interface between the solder mask and copper) by VCCT and CTOD methods
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Strain energy release rate with a/L=0.5 (crack at the interface between the solder mask and copper) by VCCT and CTOD methods

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